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VJ0805Y271 PDF预览

VJ0805Y271

更新时间: 2022-12-29 06:25:02
品牌 Logo 应用领域
威世 - VISHAY 电容器
页数 文件大小 规格书
10页 167K
描述
Surface Mount Multilayer Ceramic Chip Capacitor Solutions for Boardflex Sensitive Applications

VJ0805Y271 数据手册

 浏览型号VJ0805Y271的Datasheet PDF文件第4页浏览型号VJ0805Y271的Datasheet PDF文件第5页浏览型号VJ0805Y271的Datasheet PDF文件第6页浏览型号VJ0805Y271的Datasheet PDF文件第7页浏览型号VJ0805Y271的Datasheet PDF文件第9页浏览型号VJ0805Y271的Datasheet PDF文件第10页 
VJ OMD - X7R  
Surface Mount Multilayer Ceramic Chip Capacitor Solutions  
for Boardflex Sensitive Applications  
Vishay Vitramon  
BOARDFLEX SENSITIVE APPLICATIONS - SOLUTION:  
A predominant failure mode in multilayer ceramic chip capacitors is cracking caused by board flexure. Cracks can then create a  
path for current to pass from one electrode through the dielectric to an opposing electrode or from the terminations at one end of  
the MLCC through the dielectric to an opposing electrode. This may subsequently result in capacitance loss, leakage - low  
Insulation Resistance (IR) - and/or more seriously, high current shorts. A short circuit condition in the surface mounted capacitors  
can cause further failures of downstream components. Vishay’s Open Mode Design Capacitors (VJ OMD - Cap series) reduce  
the risk of these destructive conditions through MLCC designs that prevent board flexure cracks reaching the opposing electrode.  
VJ OMD - Cap MLCCs reduce the risk of early field failures associated with board flex cracks. However, it is important to note  
that even in the open mode designs the presence of flexure related cracks can cause capacitance loss leading to localized  
stresses on the parts. eventually, depending on the application environment, including such factors and high voltage pulse  
frequency and thermal cycling this may lead to internal breakdown of the component.  
POLYMER TERMINATION  
Polymer termination provides additional protection against board flexure damage by absorbing greater mechanical and thermal  
stresses. Componenets can be packaged, transported, stored and handled the same standard terminated product. Wave and  
reflow soldering of MLCC does not require modification to equipment and/or process. Polymer termination greatly reduces the  
risk of mechanical cracking however it does not completely eliminate.  
STANDARD TERMINATION  
OMD CAP PLUS POLYMER TERMINATION  
Exposed Electrodes = Electrical Short  
No Exposed Electrodes = No Electrical Short  
BEND TEST RESULTS 2220 CASE SIZE  
100 %  
Standard Termination  
Polymer Termination  
90 %  
Log. (Standard Termination)  
Log. (Polymer Termination)  
80 %  
70 %  
60 %  
50 %  
40 %  
30 %  
20 %  
10 %  
0 %  
0.0  
1.0  
2.0  
3.0  
4.0  
5.0  
6.0  
7.0  
8.0  
9.0  
BOARD FLEXURE in mm  
www.vishay.com  
104  
For technical questions, contact: mlcc.specials@vishay.com  
Document Number: 45046  
Revision: 28-Oct-08  

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