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VCC6-RAG-153M60000 PDF预览

VCC6-RAG-153M60000

更新时间: 2023-05-15 00:00:00
品牌 Logo 应用领域
美高森美 - MICROSEMI /
页数 文件大小 规格书
8页 588K
描述
LVPECL Output Clock Oscillator, 153.6MHz Nom, ROHS COMPLIANT, HERMETIC SEALED, CERAMIC PACKAGE-6

VCC6-RAG-153M60000 数据手册

 浏览型号VCC6-RAG-153M60000的Datasheet PDF文件第2页浏览型号VCC6-RAG-153M60000的Datasheet PDF文件第3页浏览型号VCC6-RAG-153M60000的Datasheet PDF文件第4页浏览型号VCC6-RAG-153M60000的Datasheet PDF文件第6页浏览型号VCC6-RAG-153M60000的Datasheet PDF文件第7页浏览型号VCC6-RAG-153M60000的Datasheet PDF文件第8页 
LVDS Application Diagrams  
VCC  
LVDS  
Driver  
LVDS  
Receiver  
LVDS  
Driver  
Receiver  
100ȍ  
100ȍ  
OUT+  
OUT-  
Figure 10. LVDS to LVDS Connection, Internal 100ohm  
Some LVDS structures have an internal 100 ohm resistor  
on the input and do not need additional components.  
Figure 11. LVDS to LVDS Connection  
External 100ohm and AC blocking caps  
Some input structures may not have an internal 100 ohm  
resistor on the input and will need an external 100ohm  
resistor for impedance matching. Also, the input may have  
an internal DC bias which may not be compatible with  
LVDS levels, AC blocking capacitors can be used.  
Figure 9. Standard LVDS  
Output Configuration  
One of the most important considerations is terminating the Output and Complementary Outputs equally. An unused output should not be left un-termi-  
nated, and if one of the two outputs is left open it will result in excessive jitter on both. PC board layout must take this and 50 ohm impedance matching  
into account. Load matching and power supply noise are the main contributors to jitter related problems.  
Environmental and IR Compliance  
Table 4. Environmental Compliance  
Parameter  
Mechanical Shock  
Mechanical Vibration  
Temperature Cycle  
Solderability  
Condition  
MIL-STD-883 Method 2002  
MIL-STD-883 Method 2007  
MIL-STD-883 Method 1010  
MIL-STD-883 Method 2003  
MIL-STD-883 Method 1014  
MIL-STD-883 Method 2015  
MSL1  
Fine and Gross Leak  
Resistance to Solvents  
Moisture Sensitivity Level  
Contact Pads  
Gold over Nickel  
IR Compliance  
Suggested IR Profile  
tL  
tP  
Devices are built using lead free epoxy and can be subjected to  
standard lead free IR reflow conditions shown in Table 5. Contact  
pads are gold over nickel and lower maximum temperatures can also  
be used, such as 220C.  
260  
RUP  
217  
200  
RDN  
Table 5. Reflow Profile  
Parameter  
PreHeat Time  
Symbol  
ts  
Value  
150  
25  
200 sec Max  
3°C/sec Max  
150 sec Max  
480 sec Max  
30 sec Max  
60 sec Max  
6°C/sec Max  
tS  
Ramp Up  
RUP  
Time above 217°C  
Time to Peak Temperature  
Time at 260°C  
tL  
ility  
tAMB-P  
tAMB-P  
tP  
Time at 240°C  
tP2  
Ramp down  
RDN  
Time (sec)  
Vectron International • 267 Lowell Road, Suite 102, Hudson, NH 03051 • Tel: 1-88-VECTRON-1 • http://www.vectron.com  
Page5  

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