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V30MLA0603NHAUTO

更新时间： 2024-01-28 10:31:09
品牌 Logo 应用领域
力特 - LITTELFUSE 压敏电阻
页数 文件大小 规格书
8页 729K
描述
MLA Automotive Varistor Series

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V30MLA0603NHAUTO 技术参数

是否Rohs认证： 符合生命周期：Obsolete
包装说明：Chip / Die,Reach Compliance Code：unknown
ECCN代码：EAR99HTS代码：8533.40.40.00
风险等级：5.37电路直流最大电压：30 V
电路RMS最大电压：25 V最大能量吸收容量：0.1 J
JESD-609代码：e3安装特点：SURFACE MOUNT
端子数量：2最高工作温度：125 °C
最低工作温度：-55 °C封装形状：RECTANGULAR PACKAGE
封装形式：Chip / Die包装方法：TR, PLASTIC, 13 INCH
额定功率耗散 (P)：0.05 W额定温度：150 °C
电阻器类型：VARISTOR子类别：Non-linear Resistors
表面贴装：YES技术：METAL OXIDE FILM
端子面层：Matte Tin (Sn) - with Nickel (Ni) barrier端子位置：DUAL ENDED
端子形状：WRAPAROUNDBase Number Matches：1

V30MLA0603NHAUTO 数据手册

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Varistor Products  
Surface Mount Multilayer Varistors (MLVs) > MLA Automotive Series  
Lead (Pb) Soldering Recommendations  
5IFꢀQSJODJQBMꢀUFDIOJRVFTꢀVTFEꢀGPSꢀUIFꢀTPMEFSJOHꢀPGꢀ  
Reflow Solder Profile  
DPNQPOFOUTꢀJOꢀTVSGBDFꢀNPVOUꢀUFDIOPMPHZꢀBSFꢀ*3ꢀ3FꢁnPXꢀ  
and Wave soldering. Typical profiles are shown on the right.  
250  
The recommended solder for the MLA Automotive Series  
TVQQSFTTPSꢀJTꢀBꢀꢄꢂꢑꢅꢄꢑꢂꢀꢎ4Oꢑ1Cꢑ"Hꢏꢆꢀꢄꢃꢑꢍꢃꢀꢎ4Oꢑ1CꢏꢀPSꢀꢄꢅꢑꢅꢐꢀ  
ꢎ4Oꢑ1Cꢏꢌꢀ-JUUFMGVTFꢀBMTPꢀSFDPNNFOETꢀBOꢀ3."ꢀTPMEFSꢀnVYꢌ  
MAXIMUM TEMPERATURE  
230°C  
200  
40-80  
SECONDS  
ABOVE 183°C  
150  
Wave soldering is the most strenuous of the processes.  
To avoid the possibility of generating stresses due to  
thermal shock, a preheat stage in the soldering process  
is recommended, and the peak temperature of the solder  
process should be rigidly controlled.  
RAMP RATE  
<2°C/s  
100  
PREHEAT DWELL  
PREHEAT ZONE  
50  
When using a reflow process, care should be taken  
to ensure that the MLA Automotive Series chip is not  
subjected to a thermal gradient steeper than 4 degrees  
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During the soldering process, preheating to within 100  
degrees of the solder's peak temperature is essential to  
minimize thermal shock.  
0
0
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
3.5  
4.0  
Figure 12  
TIME (MINUTES)  
Wave Solder Profile  
300  
250  
200  
150  
100  
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still necessary to ensure that any further thermal shocks  
BSFꢀBWPJEFEꢌꢀ0OFꢀQPTTJCMFꢀDBVTFꢀPGꢀUIFSNBMꢀTIPDLꢀJTꢀIPUꢀ  
printed circuit boards being removed from the solder  
process and subjected to cleaning solvents at room  
temperature. The boards must be allowed to cool gradually  
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MAXIMUMWAVE 260°C  
SECOND PREHEAT  
FIRST PREHEAT  
50  
0
0.0  
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
3.5  
4.0  
4.5  
Figure 13  
TIME (MINUTES)  
Lead–free (Pb-free) Soldering Recommendations  
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ꢗ/ꢗꢀTVGmYꢀJOꢀ1BSUꢀ/VNCFSJOHꢀ4ZTUFNꢀGPSꢀPSEFSJOHꢏꢀGPSꢀUIFꢀ  
optimum Lead–free solder performance, consisting of a  
.BUUFꢀ5JOꢀPVUFSꢀTVSGBDFꢀQMBUFEꢀPOꢀ/JDLFMꢀVOEFSMBZFSꢆꢀQMBUFEꢀ  
on Silver base metal.  
Lead–free Re-flow Solder Profile  
300  
MAXIMUM TEMPERATURE 260˚C,  
TIME WITHIN 5˚C OF PEAK  
20 SECONDS MAXIMUM  
250  
200  
150  
100  
50  
5IFꢀQSFGFSSFEꢀTPMEFSꢀJTꢀꢓꢄꢌꢈꢑꢅꢌꢃꢑꢃꢌꢈꢀꢎ4O"H$VꢏꢀXJUIꢀBOꢀ3."ꢀ  
nVYꢆꢀCVUꢀUIFSFꢀJTꢀBꢀXJEFꢀTFMFDUJPOꢀPGꢀQBTUFTꢀBOEꢀnVYFTꢀ  
BWBJMBCMFꢀXJUIꢀXIJDIꢀUIFꢀ/JDLFMꢀ#BSSJFSꢀQBSUTꢀTIPVMEꢀCFꢀ  
compatible.  
RAMP RATE  
<3˚C/s  
60 - 150 SEC  
> 217˚C  
PREHEAT ZONE  
5IFꢀSFnPXꢀQSPmMFꢀNVTUꢀCFꢀDPOTUSBJOFEꢀCZꢀUIFꢀNBYJNVNTꢀ  
JOꢀUIFꢀ-FBEoGSFFꢀ3FnPXꢀ1SPmMFꢌꢀ'PSꢀ-FBEoGSFFꢀXBWFꢀ  
TPMEFSJOHꢆꢀUIFꢀ8BWFꢀ4PMEFSꢀ1SPmMFꢀTUJMMꢀBQQMJFTꢌ  
0
0
1.0  
2.0  
3.0  
4.0  
5.0  
6.0  
7.0  
/PUFꢔꢀUIFꢀ-FBEoGSFFꢀQBTUFꢆꢀnVYꢀBOEꢀQSPmMFꢀXFSFꢀVTFEꢀGPSꢀ  
evaluation purposes by Littelfuse, based upon industry  
standards and practices. There are multiple choices of all  
UISFFꢀBWBJMBCMFꢆꢀJUꢀJTꢀBEWJTFEꢀUIBUꢀUIFꢀDVTUPNFSꢀFYQMPSFTꢀUIFꢀ  
optimum combination for their process as processes vary  
considerably from site to site.  
Figure 14  
TIME (MINUTES)  
©2010 Littelfuse, Inc.  
Specifications are subject to change without notice.  
Please refer to www.littelfuse.com/series/ML.html or MLA.html for current information.  
MLA AutomotiveVaristor Series  
Revision: December 16, 2010  
1...345678

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