Signal Relays
AXICOM
Reed Relay V23100 -V4 (Continued)
PCB layout
TOP view on component side of PCB
DIP, flat version
DIP, high version
SIL version
Mini SIL version
Dimensions
DIP, flat version
SIL version
5.08-0.2
6.4-0.2
19.8-0.2
19.3-0.2
0.6 0.1
0.5 0.1
0.25 0.1
0.25 0.1
DIP, high version
Mini SIL version
7.0-0.2
19.3-0.2
3.8-0.2
15.2-0.2
0.5 0.1
11.43
0.5 0.1
0.25 0.1
Product code structure
Type
Typical product code V23100-V4
0
05
A0
10
V23100-V4 Reed Relay, V23100-V4 Series
Version
0
DIP flat, 1 form A (NO) contact or 1 form C (CO) contact without diode
DIP high, 2 form A (NO) or 1 form C (CO) contacts
SIL, 1 form A (NO) contact
3
5
6
Mini SIL, 1 form A (NO) contact
Coil
Coil code: please refer to coil versions table
05 5VDC coil
15 15VDC coil
24 24VDC coil
12 12VDC coil
Contact arrangement
A0 1 form A (NO) contact, DIP flat or SIL package
B0 2 form A (NO) contacts, DIP high package
C0 1 form C (CO) contact, DIP high package
Coil circuit
00 Standard
10 With diode
11 With diode and electrostatic shield
3
08-2011, Rev. 0811
Datasheets and product specification
according to IEC 61810-1 and to be used
only together with the ‘Definitions’ section.
Datasheets and product data is subject to the
terms of the disclaimer and all chapters of
the ‘Definitions’ section, available at
http://relays.te.com/definitions
Datasheets, product data, ‘Definitions’ sec-
tion, application notes and all specifications
are subject to change.
www.te.com
© 2011 Tyco Electronics Corporation,
a TE Connectivity Ltd. company