US2A THRU US2M
(T =25℃ Unless otherwise specified)
■Electrical Characteristics
a
TEST
US2A US2B US2D US2F US2G US2J US2K US2M
PARAMETER
SYMBOL
UNIT
CONDITIONS
Maximum instantaneous
forward voltage drop per diode
V
I
FM
=2.0A
V
1.0
1.3
1.7
75
F
IF=0.5A,IR=1.0A,
Irr=0.25A
Maximum reverse recovery time
ns
50
trr
5.0
T =25℃
j
Maximum DC reverse current at
rated DC blocking voltage per
diode
I
μA
R
100
T =125℃
j
Thermal Characteristics (T =25℃ Unless otherwise specified)
■
a
US2A
US2B
US2D
US2F
US2G
US2J
US2K
US2M
PARAMETER
SYMBOL
UNIT
701)
221)
181)
R
θJ-A
R
Typical Thermal Resistance
θJ-L
℃/W
R
θJ-C
Note:
(1)
Thermal resistance from junction to ambient and from junction to lead mounted on P.C.B. with 0.3" x 0.3" (8.0 mm x 8.0 mm) copper pad areas
Characteristics (Typical)
■
FIG.1: Io-TL Cure
FIG.2: Forward Surge Current Capability
2.80
2.40
2.00
1.60
1.20
0.80
0.40
0
50
40
8.3ms Single Half Sine Wave
JEDEC Method
30
20
60Hz Resistive or Inductive Load
P.C.B. Mounted on 0.3"×0.3"(8.0mm×8.0mm)
Copper Pad Areas
10
0
0
30
60
90
120
150
100
80
40 60
1
2
4
6
8 10
20
Lead Temperature(℃)
Number of Cycles
2 / 5
Yangzhou Yangjie Electronic Technology Co., Ltd.
S-S4037
Rev. 1.1, 20-Sep-22
www.21yangjie.com