Datasheet > UPG2012TK-A

UPG2012TK-A

更新时间： 2024-01-15 23:56:17

品牌	Logo	应用领域
日电电子 - NEC		射频微波光电二极管
页数	文件大小	规格书
8页	283K
描述
SPDT, 500MHz Min, 2500MHz Max, 0.5dB Insertion Loss-Max, 1.5 X 1.1 MM, 0.55 MM HEIGHT, LEADLESS MINIMOLD PACKAGE-6

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技术参数
数据手册

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UPG2012TK-A 技术参数

是否无铅：	不含铅	是否Rohs认证：	符合
生命周期：	Obsolete	Reach Compliance Code：	unknown
风险等级：	5.3	构造：	COMPONENT
最大输入功率 (CW)：	26.02 dBm	最大插入损耗：	0.5 dB
JESD-609代码：	e6	最大工作频率：	2500 MHz
最小工作频率：	500 MHz	最高工作温度：	85 °C
最低工作温度：	-45 °C	射频/微波设备类型：	SPDT
端子面层：	Tin/Bismuth (Sn/Bi)

UPG2012TK-A 数据手册

UPG2012TK

RECOMMENDED SOLDERING CONDITIONS

This product should be soldered and mounted under the following recommended conditions. For soldering

methods and conditions other than those recommended below, contact your nearby sales ofﬁce.

Soldering Method

Soldering Conditions

Condition Symbol

Infrared Reﬂow

Peak temperature (package surface temperature)

Time at peak temperature

: 260°C or below

: 10 seconds or less

: 60 seconds or less

: 120±30 seconds

: 3 times

IR260

Time at temperature of 220°C or higher

Preheating time at 120 to 180°C

Maximum number of reﬂow processes

Maximum chlorine content of rosin ﬂux (% mass)

: 0.2%(Wt.) or below

VPS

Peak temperature (package surface temperature)

Time at temperature of 200°C or higher

Preheating time at 120 to 150°C

: 215°C or below

: 25 to 40 seconds

: 30 to 60 seconds

: 3 times

VP215

WS260

HS350

Maximum number of reﬂow processes

Maximum chlorine content of rosin ﬂux (% mass)

: 0.2%(Wt.) or below

Wave Soldering

Partial Heating

Peak temperature (molten solder temperature)

Time at peak temperature

: 260°C or below

: 10 seconds or less

Preheating temperature (package surface temperature) : 120°C or below

Maximum number of ﬂow processes

: 1 time

Maximum chlorine content of rosin ﬂux (% mass)

: 0.2%(Wt.) or below

Peak temperature (pin temperature)

: 350°C or below

Soldering time (per side of device)

: 3 seconds or less

: 0.2%(Wt.) or below

Maximum chlorine content of rosin ﬂux (% mass)

Caution

Do not use different soldering methods together (except for partial heating).

Life Support Applications

These NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these products can reasonably

be expected to result in personal injury. The customers of CEL using or selling these products for use in such applications do so at their own risk and

agree to fully indemnify CEL for all damages resulting from such improper use or sale.

08/30/2004

A Business Partner of NEC Compound Semiconductor Devices, Ltd.

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