品牌 | Logo | 应用领域 |
日电电子 - NEC | 有原始数据的样本ROM内存集成电路 | |
页数 | 文件大小 | 规格书 |
16页 | 230K | |
描述 | ||
MASK ROM, 1MX16, 90ns, MOS, PBGA48, 8 X 6 MM, LEAD FREE, PLASTIC, FBGA-48 |
生命周期: | Obsolete | 包装说明: | 8 X 6 MM, LEAD FREE, PLASTIC, FBGA-48 |
Reach Compliance Code: | unknown | 风险等级: | 5.7 |
最长访问时间: | 90 ns | 备用内存宽度: | 8 |
JESD-30 代码: | R-PBGA-B48 | 长度: | 8 mm |
内存密度: | 16777216 bit | 内存集成电路类型: | MASK ROM |
内存宽度: | 16 | 功能数量: | 1 |
端子数量: | 48 | 字数: | 1048576 words |
字数代码: | 1000000 | 工作模式: | ASYNCHRONOUS |
最高工作温度: | 70 °C | 最低工作温度: | -10 °C |
组织: | 1MX16 | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | LFBGA | 封装形状: | RECTANGULAR |
封装形式: | GRID ARRAY, LOW PROFILE, FINE PITCH | 并行/串行: | PARALLEL |
认证状态: | Not Qualified | 座面最大高度: | 1.24 mm |
最大供电电压 (Vsup): | 3.6 V | 最小供电电压 (Vsup): | 2.7 V |
标称供电电压 (Vsup): | 3 V | 表面贴装: | YES |
技术: | MOS | 温度等级: | COMMERCIAL |
端子形式: | BALL | 端子节距: | 0.8 mm |
端子位置: | BOTTOM | 宽度: | 6 mm |
Base Number Matches: | 1 |
型号 | 品牌 | 描述 | 获取价格 | 数据表 |
UPD23C16300F9-BC3 | NEC | 16M-BIT MASK-PROGRAMMABLE ROM 2M-WORD BY 8-BIT (BYTE MODE) / 1M-WORD BY 16-BIT (WORD MODE) |
获取价格 |
|
UPD23C16300F9-XXX-BC3 | NEC | 16M-BIT MASK-PROGRAMMABLE ROM 2M-WORD BY 8-BIT (BYTE MODE) / 1M-WORD BY 16-BIT (WORD MODE) |
获取价格 |
|
UPD23C16300GZ-MJH | NEC | 16M-BIT MASK-PROGRAMMABLE ROM 2M-WORD BY 8-BIT (BYTE MODE) / 1M-WORD BY 16-BIT (WORD MODE) |
获取价格 |
|
UPD23C16300GZ-XXX-MJH | NEC | 16M-BIT MASK-PROGRAMMABLE ROM 2M-WORD BY 8-BIT (BYTE MODE) / 1M-WORD BY 16-BIT (WORD MODE) |
获取价格 |
|
UPD23C16300GZ-XXX-MJH-A | NEC | MASK ROM, 1MX16, 90ns, MOS, PDSO48, 12 X 20 MM, LEAD FREE, PLASTIC, TSOP1-48 |
获取价格 |
|
UPD23C16303F9-XXX-BC3 | RENESAS | IC,ROM,1MX16,CMOS,BGA,48PIN,PLASTIC |
获取价格 |