uP8011
Electrical Characteristics
Parameter
Symbol
ICHG
Test Conditions
Min Typ Max Units
RPROG = 800k , VBAT=3.7V
93
100 107
Constant Charge Current
Trickle Charge Current
mA
R
PROG = 160k , VBAT=3.7V, VIN = 4.5V 465 500 535
ITRK
RPROG = 160k , VBAT=2.5V
Standby mode
20
0
50
-2.5
+1
70
-6
mA
uA
BAT Pin Current
IBAT
Shutdown mode(RIREF floating)
Sleep mode, VIN=0V
--
+2
+2
57
uA
--
+1
uA
End-of-Charge Current Threshold
Recharge Battery Voltage Threshold
IREF
IEOC RPROG = 160k
43
50
mA
mV
ΔVRCH VBAT - VRCH
100 200 300
IREF Pin Voltage
VIREF
0.792 0.8 0.808
V
V
IREF Pin Rising
1.1
0.9
1.2
1.0
1.3
1.1
Shutdown Threshold Voltage
VSD
IREF Pin Falling
STAT#
STAT Pin Sink Current
STAT Pin Weak Pull-low Current
Soft-Star
STAT pin voltage = 0.4V
5
8
--
--
mA
uA
20
35
Soft-Start Time
tSS
ICHG rising time
--
100
--
us
Deglitch Time
Recharge Deglitch Time
Termination Deglitch Time
Thermal Monitoring
Charge Current Foldback Threshold
tRCH
0.75
0.4
2
1
4.5
2.5
ms
ms
tTERM
TFOLD
TOTP
--
--
120
150
--
--
OC
OC
Over Temperature Protection
Threshold
Note 1. Stresses listed as the above “ Absolute Maximum Ratings” may cause permanent damage to the device.
These are for stress ratings. Functional operation of the device at these or any other conditions beyond those
indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may remain possibility to affect device reliability.
Note 2. Devices are ESDsensitive. Handling precaution recommended.
Note 3. θJA is measured in the natural convection at TA = 25°C on a low effective thermal conductivity test board of
JEDEC 51-3 thermal measurement standard.
Note 4. The device is not guaranteed to function outside its operating conditions.
uP8011-DS-F0000, Nov. 2012
www.upi-semi.com
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