Datasheet > U0603R471KNT

U0603R471KNT

更新时间： 2022-02-26 08:55:46

品牌	Logo	应用领域
其他 - ETC		/
页数	文件大小	规格书
19页	696K
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Multilayer Ceramic Capacitors

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U0603R471KNT 数据手册

Nickel Barrier

Multilayer Ceramic Capacitors

Component Layout

When placing / mounting the capacitors / components near an area which is apt to bend or a grid groove on the PC board. It is

advisable to have both electrodes subjected to uniform stresses, or to position the component electrodes at right angles to the grid

groove or bending line.

Figure 3 Component Layout

Uneven mounting density

O: Proper

X: Improper

Probability at which the chip capacitor is broken by the stress on PC board break

A > B = C >D > E

Mounting Density and Spaces

Placements in too narrow spaces between components may cause “ Solder Bridges” during soldering. The minimum space between

components shall be 0.5mm in view of the positioning tolerances of the mounting machines and the dimensional tolerances of the

components and PC boards.

Applications of Solder Resist

Application of Solder Resist are effective to prevent solder bridges and to control amounts of solder on PC boards ( As shown in

Table 2).

Recommended Application Examples

Examples of Solder Bridges

Narrow Spacing

between Chip

Components

Radial Components

are directly

connected to

Chip Components

Common lands are

close to Chip

Components

Page 10

27/04/06 V1.0

1...7 8 91011 12 13...19

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型号	品牌	获取价格	描述	数据表
U0603R472KNT	ETC	获取价格	Multilayer Ceramic Capacitors
U06C05	MOSPEC	获取价格	POWER RECTIFIERS(6.0A,50-200V)
U06C10	MOSPEC	获取价格	POWER RECTIFIERS(6.0A,50-200V)
U06C15	MOSPEC	获取价格	POWER RECTIFIERS(6.0A,50-200V)
U06C20	MOSPEC	获取价格	POWER RECTIFIERS(6.0A,50-200V)
U06C30	MOSPEC	获取价格	POWER RECTIFIERS(6.0A,300-600V)
U06C40	MOSPEC	获取价格	POWER RECTIFIERS(6.0A,300-600V)
U06C50	MOSPEC	获取价格	POWER RECTIFIERS(6.0A,300-600V)
U06C60	MOSPEC	获取价格	POWER RECTIFIERS(6.0A,300-600V)
U06P20PT	CHENMKO	获取价格	SUPER FAST RECOVERY RECTIFIER