TXB0101
1-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR
WITH AUTO DIRECTION SENSING AND ±15-kV ESD PROTECTION
www.ti.com
SCES639–JANUARY 2007
FEATURES
•
•
•
Available in the Texas Instruments
NanoFree™ Package
•
ESD Protection Exceeds JESD 22
–
A Port
1.2 V to 3.6 V on A Port and 1.65 V to 5.5 V on
–
–
–
2000-V Human-Body Model (A114-B)
B Port (VCCA ≤ VCCB
)
250-V Machine Model (A115-A)
VCC Isolation Feature – If Either VCC Input Is at
GND, All Outputs Are in the High-Impedance
State
1500-V Charged-Device Model (C101)
–
B Port
–
–
–
15-kV Human-Body Model (A114-B)
•
•
•
OE Input Circuit Referenced to VCCA
250-V Machine Model (A115-A)
Low Power Consumption, 5-µA Max ICC
1500-V Charged-Device Model (C101)
Ioff Supports Partial-Power-Down Mode
Operation
•
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
DBV PACKAGE
(TOP VIEW)
DCK PACKAGE
(TOP VIEW)
DRL PACKAGE
(TOP VIEW)
YZP PACKAGE
(BOTTOM VIEW)
3
2
1
4
5
6
A
GND
VCCA
B
1
2
3
6
5
4
VCCA
VCCB
OE
1
2
3
6
5
4
VCCA
GND
A
VCCB
OE
1
2
3
6
5
4
VCCA
GND
A
VCCB
OE
OE
GND
A
VCCB
B
B
B
See mechanical drawings for dimensions.
DESCRIPTION/ORDERING INFORMATION
This 1-bit noninverting translator uses two separate configurable power-supply rails. The A port is designed to
track VCCA. VCCA accepts any supply voltage from 1.2 V to 3.6 V. The B port is designed to track VCCB. VCCB
accepts any supply voltage from 1.65 V to 5.5 V. This allows for universal low-voltage bidirectional translation
between any of the 1.2-V, 1.5-V, 1.8-V, 2.5-V, 3.3-V, and 5-V voltage nodes. VCCA should not exceed VCCB
.
When the output-enable (OE) input is low, all outputs are placed in the high-impedance state.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
To ensure the high-impedance state during power up or power down, OE should be tied to GND through a
pulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the
driver.
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the
package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoFree is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Copyright © 2007, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.