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TXB0101 PDF预览

TXB0101

更新时间: 2024-01-29 14:27:13
品牌 Logo 应用领域
德州仪器 - TI /
页数 文件大小 规格书
18页 490K
描述
1-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR WITH AUTO DIRECTION SENSING AND 【15-kV ESD PROTECTION

TXB0101 数据手册

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TXB0101  
1-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR  
WITH AUTO DIRECTION SENSING AND ±15-kV ESD PROTECTION  
www.ti.com  
SCES639JANUARY 2007  
FEATURES  
Available in the Texas Instruments  
NanoFree™ Package  
ESD Protection Exceeds JESD 22  
A Port  
1.2 V to 3.6 V on A Port and 1.65 V to 5.5 V on  
2000-V Human-Body Model (A114-B)  
B Port (VCCA VCCB  
)
250-V Machine Model (A115-A)  
VCC Isolation Feature – If Either VCC Input Is at  
GND, All Outputs Are in the High-Impedance  
State  
1500-V Charged-Device Model (C101)  
B Port  
15-kV Human-Body Model (A114-B)  
OE Input Circuit Referenced to VCCA  
250-V Machine Model (A115-A)  
Low Power Consumption, 5-µA Max ICC  
1500-V Charged-Device Model (C101)  
Ioff Supports Partial-Power-Down Mode  
Operation  
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
DBV PACKAGE  
(TOP VIEW)  
DCK PACKAGE  
(TOP VIEW)  
DRL PACKAGE  
(TOP VIEW)  
YZP PACKAGE  
(BOTTOM VIEW)  
3
2
1
4
5
6
A
GND  
VCCA  
B
1
2
3
6
5
4
VCCA  
VCCB  
OE  
1
2
3
6
5
4
VCCA  
GND  
A
VCCB  
OE  
1
2
3
6
5
4
VCCA  
GND  
A
VCCB  
OE  
OE  
GND  
A
VCCB  
B
B
B
See mechanical drawings for dimensions.  
DESCRIPTION/ORDERING INFORMATION  
This 1-bit noninverting translator uses two separate configurable power-supply rails. The A port is designed to  
track VCCA. VCCA accepts any supply voltage from 1.2 V to 3.6 V. The B port is designed to track VCCB. VCCB  
accepts any supply voltage from 1.65 V to 5.5 V. This allows for universal low-voltage bidirectional translation  
between any of the 1.2-V, 1.5-V, 1.8-V, 2.5-V, 3.3-V, and 5-V voltage nodes. VCCA should not exceed VCCB  
.
When the output-enable (OE) input is low, all outputs are placed in the high-impedance state.  
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,  
preventing damaging current backflow through the device when it is powered down.  
To ensure the high-impedance state during power up or power down, OE should be tied to GND through a  
pulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the  
driver.  
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the  
package.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
NanoFree is a trademark of Texas Instruments.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 2007, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  

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