Datasheet > TUSB212QRWBTQ1

TUSB212QRWBTQ1

更新时间： 2023-09-03 20:32:52

品牌	Logo	应用领域
德州仪器 - TI		调节器
页数	文件大小	规格书
27页	1470K
描述
具有直流升压功能和直通封装的汽车类 USB 2.0 高速信号调节器 \| RWB \| 12 \| -40 to 105

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TUSB212QRWBTQ1 数据手册

TUSB212-Q1

ZHCSGN1 –AUGUST 2017

www.ti.com.cn

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)⁽¹⁾

MIN

MAX

UNIT

Supply Voltage

VCC

-0.3

3.8

Range

Voltage Range

DxP, DxM, RSTN, EQ, SCL, SDA, DC_BOOST, VREG

on I/O pins

-0.3

-65

3.8

T_stg

Storage temperature

150

°C

(1) Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 ESD Ratings

VALUE

UNIT

Human body model (HBM), per

±2000

ANSI/ESDA/JEDEC JS-001, all pins⁽¹⁾

V_(ESD)

Electrostatic discharge

Charged device model (CDM), per JEDEC

specification JESD22-C101, all pins⁽²⁾

±500

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

3.6

UNIT

V_CC

T_A

Supply voltage

3.3

Ambient temperature

Junction temperature

TUSB212Q1

-40

105

°C

T_J

°C

6.4 Thermal Information

RWB (VQFN)

12 PINS

137.4

THERMAL METRIC⁽¹⁾

UNIT

R_θJA

Junction-to-ambient thermal resistance

Junction-to-case (top) thermal resistance

Junction-to-board thermal resistance

°C/W

R_θJC(top)

R_θJB

67.2

Ψ_JT

Junction-to-top characterization parameter

Junction-to-board characterization parameter

Junction-to-case (bottom) thermal resistance

1.9

Ψ_JB

67.3

R_θJC(bot)

N/A

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

1 2 345 6 7...27

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