TUSB1004
ZHCSMM7 –APRIL 2022
www.ti.com.cn
5 Specifications
5.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN
MAX
UNIT
Supply Voltage Range
VCC
4
V
–0.3
Differential voltage between positive and negative
inputs
-2.5
2.5
V
Voltage Range at any input or output pin
Voltage at differential inputs
CMOS Inputs
4
4
V
–0.5
–0.5
V
TUSB1004
105
125
150
°C
°C
°C
Maximum junction temperature, TJ
Storage temperature, Tstg
TUSB1004I
–65
(1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute maximum ratings do not imply
functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If
briefly operating outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not
sustain damage, but it may not be fully functional. Operating the device in this manner may affect device reliability, functionality,
performance, and shorten the device lifetime.
5.2 ESD Ratings
VALUE
±2000
±1500
UNIT
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
Charged-device model (CDM), per ANSI/ESDA/JEDEC JS-002(2)
V(ESD)
Electrostatic discharge
V
(1) JEDEC document JEP155 states that 500-V HBM allows safemanufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safemanufacturing with a standard ESD control process.
5.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
3.0
NOM
MAX
3.6
UNIT
Main power supply
3.3
V
VCC
Main supply ramp requirement
0.1
50
ms
Supply that external resistors are pulled up to for both SDA and SCL
pins
V(I2C)
1.7
3.6
V
V(PSN)
Supply Noise on VCC pins (less than 4MHz)
TUSB1004 Operating free-air temperature
TUSB1004I Operating free-air temperature
50
70
85
mVpp
°C
0
TA
-40
°C
5.4 Thermal Information
TUSB1004
THERMAL METRIC(1)
RNQ (WQFN)
40 PINS
31.4
UNIT
RθJA
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
RθJC(top)
RθJB
21.8
Junction-to-board thermal resistance
12.2
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
0.3
ψJT
12.2
ψJB
RθJC(bot)
4.3
(1) For more information about traditional and new thermalmetrics, see the Semiconductor and ICPackage Thermal Metrics application
report.
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