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TSXPC750ACVIP233DE PDF预览

TSXPC750ACVIP233DE

更新时间: 2024-01-27 14:33:50
品牌 Logo 应用领域
爱特美尔 - ATMEL PC外围集成电路
页数 文件大小 规格书
17页 209K
描述
RISC Microprocessor, 32-Bit, 233MHz, CMOS, 2.54 MM PITCH, PCM, PGA-288

TSXPC750ACVIP233DE 技术参数

生命周期:Obsolete零件包装代码:PGA
包装说明:,针数:288
Reach Compliance Code:unknownECCN代码:3A001.A.2.C
HTS代码:8542.31.00.01风险等级:5.84
地址总线宽度:32位大小:32
边界扫描:YES外部数据总线宽度:64
集成缓存:YESJESD-30 代码:R-XXMA-P288
端子数量:288最高工作温度:85 °C
最低工作温度:-40 °C封装主体材料:UNSPECIFIED
封装形状:RECTANGULAR封装形式:MICROELECTRONIC ASSEMBLY
认证状态:Not Qualified速度:233 MHz
最大供电电压:2.73 V最小供电电压:2.47 V
标称供电电压:2.6 V表面贴装:NO
技术:CMOS温度等级:INDUSTRIAL
端子形式:PIN/PEG端子位置:UNSPECIFIED
uPs/uCs/外围集成电路类型:MICROPROCESSOR, RISCBase Number Matches:1

TSXPC750ACVIP233DE 数据手册

 浏览型号TSXPC750ACVIP233DE的Datasheet PDF文件第2页浏览型号TSXPC750ACVIP233DE的Datasheet PDF文件第3页浏览型号TSXPC750ACVIP233DE的Datasheet PDF文件第4页浏览型号TSXPC750ACVIP233DE的Datasheet PDF文件第5页浏览型号TSXPC750ACVIP233DE的Datasheet PDF文件第6页浏览型号TSXPC750ACVIP233DE的Datasheet PDF文件第7页 
TSPC750IP  
Processor and Cache Module  
DESCRIPTION  
The Processor and Cache Module (PCM) is a 17 x 17 pin grid  
array (PGA) circuit assembly which combines a PowerPCt  
microprocessor and SRAM components into a CPU subsys-  
tem. The PCM provides a standard mechanical, electrical, and  
functional interface which can be socketed on a computer sys-  
tem board and allows many combinations of processors and  
optional components to be easily interchanged. This docu-  
ment describes the general characteristics for a module con-  
sisting of a single PowerPCt microprocessor and two SRAM  
devices for L2 cache. The PCM packaging and PGA signal  
definition also accomodates single processors without SRAM,  
and multiple processors.  
The PCM consists of an epoxy–glass (FR4) substrate which  
adapts a processor in a ceramic ball grid array (CBGA) pac-  
kage with 50 mil spacing to a 288–pin PGA with 100 mil spac-  
ing that can be easily socketed and hence, easily upgraded.  
The FR4 substrate can be extended beyond the area of the 17  
x 17 pin grid array to provide an interconnect area for SRAM  
components configured as closely coupled L2 cache. The  
resulting PCM provides numerous flexible configurations of  
processor and cache for various price/performance system  
designs.  
FR4 PCM on PGA 288 Interposer  
I
N
T
60x Address  
L2 Addr  
L2–Cache  
Memory  
Chips  
60x Data  
TSPC750  
L2 Data  
E
R
P
O
S
E
R
60x Control  
L2 Control  
Processor  
PLL_CFG  
P
I
N
S
General  
Support  
Circuits  
VID  
PID  
Simplified Block Diagram  
1/17  
April 1999  

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