Document No TRF18OS002A
Issued date
Page
2011/08/15
6/8
Lead Free SMD Resettable Fuse
8. Environment
8.1 Operating Conditions
Operating Temperature: -40℃ to 85℃
Device Surface Temperature in Tripped State: 125℃ max
8.2 Environmental Specifications
TEST ITEM
Condition
Resistance Change
85℃,1000hr
±5% typical
±5% typical
Passive aging
Humidity aging
85℃,85%R.H,1000hr
85℃ to -40℃,20times
±10% typical
Thermal shock
Resistance to solvent
Vibration
MIL-STD-202,Method215
No change
No change
MIL-STD-883C,Method2007.1
Condition A
8.3 Solder Reflow Recommendations
‧Recommend reflow methods : IR, vapor phase oven, hot air oven.
‧Devices are not designed to be wave soldered to the bottom side
of the board.
‧Recommended maximum paste thickness is 0.25 mm(0.010 inch).
‧Devices can be cleaned using standard method and solvents.
Note : If reflow temperatures exceed the recommended profile,
devices may not meet the performance requirements.
TA-I TECHNOLOGY CO., LTD
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.