Datasheet > TQM8M9075

TQM8M9075

更新时间： 2022-04-15 12:06:29

品牌	Logo	应用领域
TRIQUINT		放大器
页数	文件大小	规格书
8页	771K
描述
0.05â4 GHz Digital Variable Gain Amplifier

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TQM8M9075 数据手册

TQM8M9075

0.05−4 GHz Digital Variable Gain Amplifier

Mechanical Information

Package Marking and Dimensions

Marking: Part number – TQM8M9075

Year, week, country code - YYWW CCCC

Assembly Code – AaXXXX

.10

TERMINAL #1

IDENTIFIER

5.0±0.1

32X 0.50 Pitch

0.25

32X 0.10

(32X) 0.450x X 0.240y

0.10

TERMINAL #1

IDENTIFIER

A B

1.90

TQM8M9075

YYWW CCCC

AaXXXX

4.50

5.0±0.1

0.25

1.90

0.20

(1X) shape

0.10

A B

.10

1.90

4.50

GND/THERMAL PAD

.10

1.02±0.08

32X

.08

SEATING PLANE

Notes:

1. All dimensions are in millimeters. Angles are in degrees.

2. Except where noted, this part outline conforms to JEDEC standard MO-220, Issue E (Variation VGGC) for thermally

enhanced plastic very thin fine pitch quad flat no lead package (QFN).

3. Dimension and tolerance formats conform to ASME Y14.4M-1994.

4. The terminal #1 identifier and terminal numbering conform to JESD 95-1 SPP-012.

PCB Mounting Pattern

25X

PACKAGE

OUTLINE

28X 0.28

0.50 PITCH

0.12

28X 0.75

3.70

0.76

0.38

0.66

3.70

COMPONENT SIDE

Notes:

1. All dimensions are in millimeters. Angles are in degrees.

2. Use 1 oz. copper minimum for top and bottom layer metal.

3. Vias are required under the backside paddle of this device for proper RF/DC grounding and thermal dissipation. We

recommend a 0.35mm (#80/.0135") diameter bit for drilling via holes and a final plated thru diameter of 0.25 mm (0.10”).

4. Ensure good package backside paddle solder attach for reliable operation and best electrical performance.

Data Sheet: Rev F 12/05/2012

- 7 of 8 -

Disclaimer: Subject to change without notice

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