Datasheet > TPSM843820

TPSM843820

更新时间： 2024-03-03 10:10:20

品牌	Logo	应用领域
德州仪器 - TI		电源电路
页数	文件大小	规格书
38页	1994K
描述
具有 4V 至 18V 输入和高级电流模式的 8A 同步 SWIFT? 降压电源模块

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TPSM843820 数据手册

TPSM843820

ZHCSPU4A –OCTOBER 2023 –REVISED DECEMBER 2023

www.ti.com.cn

5 Specifications

5.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted) ⁽¹⁾

MIN

–0.3

–6

MAX

UNIT

Input voltage

Output voltage

VIN

VIN to SW, DC

VIN to SW, transient 20ns

BOOT

–0.3

–5

BOOT to SW

EN, PGOOD, MODE, SYNC/FSEL, FB

SW, DC

SW, transient 20 ns

Operating junction

temperature, T_J

Operating junction temperature, T_J

125

150

°C

–40

–55

Storage temperature, T_stg

(1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply

functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If

used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully

functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.

5.2 ESD Ratings

VALUE

UNIT

Human-body model (HBM), per ANSI/ESDA/JEDEC

JS-001⁽¹⁾

V_(ESD)

Electrostatic discharge

±2000

Charged-device model (CDM), per ANSI/ESDA/JEDEC

JS-002⁽²⁾

±500

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

5.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Input voltage

Output voltage

Output current

T_J

V_IN

SYNC/FSEL, EN, PGOOD

V_OUT

5.5

1.8

–0.1

0.5

I_OUT

Operating junction temperature

External clock frequency

125

2600

°C

–40

f_SYNC

400

kHz

5.4 Thermal Information

TPSM843x20

uSiP (TI EVM)

15 PINS

29.9

THERMAL METRIC⁽¹⁾

UNIT

R_θJA

Junction-to-ambient thermal resistance

°C/W

Junction-to-board characterization parameter

9.82

ψ_JB

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

English Data Sheet: SLUSEU1

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