TPS62000-HT
SLVS917A–MARCH 2009–REVISED JUNE 2009.......................................................................................................................................................... www.ti.com
BARE DIE INFORMATION
BACKSIDE
POTENTIAL
BOND PAD
METALLIZATION COMPOSITION
DIE THICKNESS
BACKSIDE FINISH
15 mils.
Silicon with backgrind
GND
Al-Si-Cu (0.5%)
Origin
a
c
b
d
Bond Pad Coordinates in Microns - Rev A
DESCRIPTION
FB
PAD NUMBER
a
b
c
d
1
2
142.15
142.15
907.35
1001.35
1095.35
1189.35
1296.85
1296.85
1296.85
1128.20
1128.20
1350.50
1350.50
1350.50
92.40
92.40
227.15
227.15
983.35
1077.35
1171.35
1265.35
1381.85
1381.85
1381.85
1213.20
1213.20
1435.50
1435.50
1435.50
177.40
177.40
177.40
177.40
175.60
177.40
279.40
180.05
180.05
180.05
180.05
175.60
277.60
920.10
1279.55
1381.55
1891.50
1993.50
2095.50
2041.85
1939.85
1772.70
1614.00
1380.70
Do not use
Do not use
Do not use
Do not use
Do not use
Do not use
SYNC
194.40
104.05
104.05
104.05
104.05
90.60
3
4
5
6
7
8
192.60
835.10
1194.55
1296.55
1806.50
1908.50
2010.50
1956.85
1854.85
1687.70
1529.00
1295.70
EN
9
L
10
11
12
13
14
15
16
17
18
19
L
Do not use
PGND
PGND
Vin
Vin
92.40
Do not use
FC
92.40
92.40
GND
90.60
4
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