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TO263

更新时间： 2024-02-13 02:06:51

品牌	Logo	应用领域
美台 - DIODES		/
页数	文件大小	规格书
14页	183K
描述
SUGGESTED PAD LAYOUT

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中文翻译

获取价格

数据手册

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TO263 数据手册

SUGGESTED PAD LAYOUT

Based on IPC-7351A

X1-DFN1006-2 / X2-DFN1006-2 / MiniMELF / MELF / SOD323 / SOD123 / SOD523 / SMA / SMB / SMC

X1-DFN1006-2 /

X2-DFN1006-2

Dimensions

MiniMELF

MELF

SOD123

SOD323

SOD523

SMA

SMB

SMC

1.1

0.3

0.7

0.4

0.7

4.7

2.1

1.7

1.3

3.5

6.3

3.3

2.7

1.5

4.8

4.9

2.5

0.7

1.2

3.7

3.75

1.05

0.65

1.35

2.40

2.3

1.1

0.8

0.6

1.7

6.5

1.5

1.7

2.5

4.0

6.8

1.8

2.3

2.5

4.3

9.4

4.4

3.3

2.5

6.8

X3-DFN0603-2

X1-DFN1006-3 / X2-DFN1006-3

Dimensions Value (in mm)

1.1

0.3

0.2

0.7

0.25

0.4

0.7

Dimensions Value (in mm)

0.355

0.230

0.300

0.610

Y (2x)

X (2x)

X1-DFN1212-3

Dimensions

Value (in mm)

0.80

0.42

(2x)

0.32

0.50

1.50

(2x)

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.

These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave

soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming

Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

AP02001 Rev. 43

1 of 14

www.diodes.com

Suggested Pad Layout

12 3 4 5 6 7...14

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TO-263-5	AME	获取价格	Carrier Width (W) 24.0-0.1 mm Pitch (P) 4.0-0.1 mm
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