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TNY275 PDF预览

TNY275

更新时间: 2024-01-30 11:55:07
品牌 Logo 应用领域
帕沃英蒂格盛 - POWERINT /
页数 文件大小 规格书
24页 1607K
描述
Energy Efficient, Off-Line Switcher with Enhanced Flexibility and Extended Power Range

TNY275 技术参数

是否Rohs认证: 符合生命周期:Active
零件包装代码:DIP包装说明:DIP, DIP7/8,.3
针数:8Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8542.39.00.01
风险等级:0.86模拟集成电路 - 其他类型:SWITCHING REGULATOR
控制模式:CURRENT-MODE控制技术:PULSE WIDTH MODULATION
最大输入电压:2.6 V最小输入电压:1.8 V
标称输入电压:2.2 VJESD-30 代码:R-PDIP-T7
JESD-609代码:e3长度:9.575 mm
功能数量:1端子数量:7
最高工作温度:125 °C最低工作温度:-40 °C
最大输出电流:0.294 A封装主体材料:PLASTIC/EPOXY
封装代码:DIP封装等效代码:DIP7/8,.3
封装形状:RECTANGULAR封装形式:IN-LINE
峰值回流温度(摄氏度):NOT SPECIFIED认证状态:Not Qualified
子类别:Power Management Circuits最大供电电流 (Isup):0.4 mA
表面贴装:NO切换器配置:SINGLE
最大切换频率:140 kHz温度等级:AUTOMOTIVE
端子面层:Matte Tin (Sn)端子形式:THROUGH-HOLE
端子节距:2.54 mm端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:7.62 mm
Base Number Matches:1

TNY275 数据手册

 浏览型号TNY275的Datasheet PDF文件第18页浏览型号TNY275的Datasheet PDF文件第19页浏览型号TNY275的Datasheet PDF文件第20页浏览型号TNY275的Datasheet PDF文件第22页浏览型号TNY275的Datasheet PDF文件第23页浏览型号TNY275的Datasheet PDF文件第24页 
TNY274-280  
PART ORDERING INFORMATION  
TinySwitch Product Family  
Series Number  
Package Identifier  
G
P
Plastic Surface Mount SMD-8C  
Plastic DIP-8C  
Lead Finish  
N
Pure Matte Tin (Pb-Free)  
Tape & Reel and Other Options  
Blank Standard Configurations  
TL  
Tape & Reel, 1000 pcs min./mult., G Package only  
TNY 278 G N - TL  
DIP-8C  
D S .004 (.10)  
Notes:  
-E-  
1. Package dimensions conform to JEDEC specification  
MS-001-AB (Issue B 7/85) for standard dual-in-line (DIP)  
package with .300 inch row spacing.  
2. Controlling dimensions are inches. Millimeter sizes are  
shown in parentheses.  
.240 (6.10)  
.260 (6.60)  
3. Dimensions shown do not include mold flash or other  
protrusions. Mold flash or protrusions shall not exceed  
.006 (.15) on any side.  
4. Pin locations start with Pin 1, and continue counter-clock-  
wise to Pin 8 when viewed from the top. The notch and/or  
dimple are aids in locating Pin 1. Pin 3 is omitted.  
5. Minimum metal to metal spacing at the package body for  
the omitted lead location is .137 inch (3.48 mm).  
6. Lead width measured at package body.  
Pin 1  
-D-  
.367 (9.32)  
.387 (9.83)  
7. Lead spacing measured with the leads constrained to be  
perpendicular to plane T.  
.057 (1.45)  
.068 (1.73)  
(NOTE 6)  
.125 (3.18)  
.145 (3.68)  
.015 (.38)  
MINIMUM  
-T-  
SEATING  
PLANE  
.008 (.20)  
.015 (.38)  
.120 (3.05)  
.140 (3.56)  
.300 (7.62) BSC  
(NOTE 7)  
.100 (2.54) BSC  
.048 (1.22)  
.053 (1.35)  
.137 (3.48)  
MINIMUM  
P08C  
.300 (7.62)  
.390 (9.91)  
.014 (.36)  
.022 (.56)  
T E D S .010 (.25) M  
PI-3933-100504  
E
2/06  
21  

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