TLP331,TLP332
Absolute Maximum Ratings (Ta = 25°C)
Characteristics
Symbol
Rating
Unit
Forward current
I
50
-0.7
1
mA
mA/°C
A
F
Forward current derating (Ta ≥ 39°C)
Peak forward current (100 μs pulse, 100 pps)
Reverse Voltage
ΔI /°C
F
I
FP
V
P
5
V
R
D
50
mW
mW/°C
Diode power dissipation
ΔP /°C
-0.58
Diode power dissipation derating (Ta >39 °C)
Junction temperature
D
T
125
55
80
7
°C
V
j
Collector-emitter voltage
V
V
V
V
CEO
CBO
ECO
Collector-base voltage (TLP331)
Emitter-collector voltage
V
V
Emitter-base voltage (TLP331)
7
V
EBO
Collector current
I
50
mA
C
Power dissipation
P
150
-1.5
mW
mW/°C
°C
C
Power dissipation derating (Ta ≥ 25°C)
Junction temperature
ΔP °C
C/
T
125
j
Storage temperature range
T
-55 to 125
-55 to 100
260
°C
stg
opr
Operating temperature range
T
°C
Lead soldering temperature (10 s)
Total package power dissipation
Total package power dissipation derating (Ta ≥ 25°C)
Isolation voltage (AC, 60 s, RH ≤ 60 %)
T
°C
sol
P
250
mW
mW/°C
Vrms
T
P /°C
T
-2.5
(Note 1)
BV
5000
S
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc.).
Note 1: Device considered a two terminal device: Pins 1, 2 and 3 shorted together and pins 4, 5 and 6 shorted
together.
Recommended Operating Conditions
Characteristics
Supply voltage
Symbol
Min
Typ.
Max
Unit
V
―
—
5
1.6
1
25
25
10
75
V
CC
Forward current
I
mA
mA
°C
F
Collector current
I
―
C
Operating temperature
T
-25
―
opr
Note: Recommended operating conditions are given as a design guideline to obtain expected performance of the
device. Additionally, each item is an independent guideline respectively. In developing designs using this
product, please confirm specified characteristics shown in this document.
© 2019
Toshiba Electronic Devices & Storage Corporation
2
2019-06-24