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TLP165J_07 PDF预览

TLP165J_07

更新时间: 2022-04-23 23:00:11
品牌 Logo 应用领域
东芝 - TOSHIBA 可控硅光电二极管
页数 文件大小 规格书
4页 175K
描述
Photocoupler GaAs Ired & Photo-Triac

TLP165J_07 数据手册

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TLP165J  
Absolute Maximum Ratings (Ta = 25°C)  
Characteristic  
Symbol  
Rating  
Unit  
Forward current  
I
50  
0.7  
1
mA  
F
Forward current derating (Ta 53°C)  
Peak forward current (100μs pulse, 100 pps)  
Reverse voltage  
ΔI / °C  
F
mA / °C  
I
A
V
FP  
V
5
R
Junction temperature  
T
125  
600  
70  
°C  
V
j
Offstate output terminal voltage  
V
DRM  
Ta=25°C  
Onstate RMS current  
Ta=70°C  
I
mA  
T(RMS)  
40  
Onstate current derating (Ta 25°C)  
ΔI / °C  
0.67  
2
mA / °C  
A
T
Peak onstate current (100μs pulse, 120 pps)  
I
TP  
Peak nonrepetitive surge current  
(PW=10ms, DC=10%)  
I
1.2  
A
TSM  
Junction temperature  
Storage temperature range  
Operating temperature range  
Lead soldering temperature (10s)  
T
115  
55~125  
40~100  
260  
°C  
°C  
j
T
stg  
opr  
T
°C  
T
°C  
sol  
Isolation voltage (AC, 1 min., R.H. 60%)  
(Note 2)  
BV  
2500  
Vrms  
S
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the  
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even  
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum  
ratings.  
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook  
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test  
report and estimated failure rate, etc).  
(Note 2) Device considered a two terminal device: Pins 1 and 3 shorted together and 4 and 6 shorted together.  
Recommended Operating Conditions  
Characteristic  
Symbol  
Min.  
Typ.  
Max.  
Unit  
Supply voltage  
Forward current  
V
15  
20  
240  
25  
1
Vac  
mA  
A
AC  
I
F
Peak onstate current  
I
TP  
Operating temperature  
T
opr  
25  
85  
°C  
Note: Recommended operating conditions are given as a design guideline to obtain expected performance of the  
device. Additionally, each item is an independent guideline respectively. In developing designs using this  
product, please confirm specified characteristics shown in this document.  
2
2007-10-01  

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