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TLE94110ELXUMA1 PDF预览

TLE94110ELXUMA1

更新时间: 2024-02-05 12:47:41
品牌 Logo 应用领域
英飞凌 - INFINEON 电动机控制光电二极管
页数 文件大小 规格书
80页 1160K
描述
Brush DC Motor Controller, 2A, PDSO24, SSOP-24

TLE94110ELXUMA1 技术参数

是否Rohs认证: 符合生命周期:Active
包装说明:HLSSOP,Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8542.39.00.01
Factory Lead Time:1 week风险等级:1.66
模拟集成电路 - 其他类型:BRUSH DC MOTOR CONTROLLERJESD-30 代码:R-PDSO-G24
长度:8.65 mm湿度敏感等级:3
功能数量:1端子数量:24
最高工作温度:85 °C最低工作温度:-40 °C
最大输出电流:2 A封装主体材料:PLASTIC/EPOXY
封装代码:HLSSOP封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH峰值回流温度(摄氏度):NOT SPECIFIED
座面最大高度:1.7 mm最大供电电压 (Vsup):5.5 V
最小供电电压 (Vsup):3 V标称供电电压 (Vsup):5 V
表面贴装:YES温度等级:INDUSTRIAL
端子形式:GULL WING端子节距:0.65 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:3.9 mmBase Number Matches:1

TLE94110ELXUMA1 数据手册

 浏览型号TLE94110ELXUMA1的Datasheet PDF文件第3页浏览型号TLE94110ELXUMA1的Datasheet PDF文件第4页浏览型号TLE94110ELXUMA1的Datasheet PDF文件第5页浏览型号TLE94110ELXUMA1的Datasheet PDF文件第7页浏览型号TLE94110ELXUMA1的Datasheet PDF文件第8页浏览型号TLE94110ELXUMA1的Datasheet PDF文件第9页 
TLE94110EL  
Pin Configuration  
Pin  
13  
14  
15  
16  
Symbol  
GND  
Function  
Ground. All ground pins should be externally connected together.  
Power half-bridge 3  
OUT 3  
OUT 10  
VS1  
Power half-bridge 10  
Main supply voltage for power half bridges. VS1 should be externally connected to  
VS2.  
17  
18  
19  
20  
21  
N.U.  
N.U.  
CSN  
SCLK  
VS2  
Not used. This pin should be left open.  
Not used. This pin should be left open.  
Chip select Not input with internal pull up  
Serial clock input with internal pull down  
Main supply voltage for power half bridges. VS1 should be externally connected to  
VS2.  
22  
OUT 8  
OUT 2  
GND  
-
Power half-bridge 8  
23  
Power half-bridge 2  
24  
Ground. All ground pins should be externally connected together.  
EDP  
Exposed Die Pad; For cooling and EMC purposes only - not usable as electrical  
ground. Electrical ground must be provided by pins 1,12,13,24.1)  
1) The exposed die pad at the bottom of the package allows better heat dissipation from the device via the PCB. The  
exposed pad (EP) must be either left open or connected to GND. It is recommended to connect EP to GND for best  
EMC and thermal performance.  
Note:  
Not used (N.U.) pins and unused outputs are recommended to be left unconnected (open) on the  
application board. If N.U. pins or unused output pins are routed to an external connector which  
leaves the PCB, then these outputs should have provision for a zero ohm jumper (depopulated if  
unused) or ESD protection. In other words, they should be treated like used pins.  
Data Sheet  
6
1.0  
2016-08-27  

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