THD3 Series
PLETRONICS
STRATUM-III TYPE TCXO / TCVCXO
Mechanical Dimensions
Inches
mm
0.197 ± 0.008 5.00 ± 0.20
A
B
0.126 ± 0.008 3.20 ± 0.20
0.059 max
0.055
1.50 max
1.40
C
D1
E1
F1
G1
H1
J1
0.031
0.80
0.043
1.10
0.102
2.60
0.020C
0.008R
0.50C
0.20R
1 Typical dimensions
Pad Layout mm shown (Top View)
Disclaimer: Recommended layout shown.
Adjust pad layout as needed for individual
process requirements.
Solder mask required, as shown.
(Not to Scale)
Contacts (pads): Gold 11.8 to 39.4 µinches (0.3 to 1.0 µm) over Nickel 50 to 350 µinches (1.27 to 8.89 µm)
Layout
Pad Function
Note
Vcontrol Input
Ground (GND)
Output
If this function is not specified, recommend connecting this pad to ground. EFC (Electronic Frequency Control).
1
2
3
4
-
CMOS
VCC Supply Voltage
N.C.
Connect an appropriate 10nF power supply bypass capacitor as close as possible
All other pads on the bottom shall not be connected.
These are internally connected for the TCXO compensation process
All connection points in the designated region have solder mask cover to avoid any electrical connections
(top view shown)
For Optimum Jitter Performance, Pletronics recommends:
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$
$
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A ground plane under the device
Do not route large transient signals (both current and voltage) under the device
Do not place near a large magnetic field such as a high frequency switching power supply
Do not place near piezoelectric buzzers or mechanical fans
Minimize air flow across the device
Product information is current as of publication date. The product conforms to specifications per the terms of the Pletronics standard warranty.
Production processing does not necessarily include testing of all parameters.
Aug 27, 2019 Rev. E
Pg 3
Copyright © 2019, Pletronics Inc. 19013 36th Ave. W, Lynnwood, WA 98036 USA www.pletronics.com 425-776-1880