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TDA9817TS PDF预览

TDA9817TS

更新时间: 2024-01-09 20:25:16
品牌 Logo 应用领域
恩智浦 - NXP 消费电路商用集成电路接收器集成电路光电二极管
页数 文件大小 规格书
41页 234K
描述
Single/multistandard VIF/SIF-PLL and FM-PLL/AM demodulators

TDA9817TS 技术参数

是否Rohs认证:符合生命周期:Transferred
包装说明:SSOP, SSOP24,.3Reach Compliance Code:unknown
风险等级:5.68Is Samacsys:N
JESD-30 代码:R-PDSO-G24端子数量:24
最高工作温度:70 °C最低工作温度:-20 °C
封装主体材料:PLASTIC/EPOXY封装代码:SSOP
封装等效代码:SSOP24,.3封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, SHRINK PITCH电源:5 V
认证状态:Not Qualified子类别:Other Consumer ICs
最大压摆率:104 mA表面贴装:YES
技术:BIPOLAR温度等级:COMMERCIAL
端子形式:GULL WING端子节距:0.635 mm
端子位置:DUALBase Number Matches:1

TDA9817TS 数据手册

 浏览型号TDA9817TS的Datasheet PDF文件第35页浏览型号TDA9817TS的Datasheet PDF文件第36页浏览型号TDA9817TS的Datasheet PDF文件第37页浏览型号TDA9817TS的Datasheet PDF文件第39页浏览型号TDA9817TS的Datasheet PDF文件第40页浏览型号TDA9817TS的Datasheet PDF文件第41页 
Philips Semiconductors  
Product specification  
Single/multistandard VIF/SIF-PLL and  
FM-PLL/AM demodulators  
TDA9817; TDA9818  
During placement and before soldering, the package must  
be fixed with a droplet of adhesive. The adhesive can be  
applied by screen printing, pin transfer or syringe  
dispensing. The package can be soldered after the  
adhesive is cured.  
MANUAL SOLDERING  
Fix the component by first soldering two  
diagonally-opposite end leads. Use a low voltage (24 V or  
less) soldering iron applied to the flat part of the lead.  
Contact time must be limited to 10 seconds at up to  
300 °C. When using a dedicated tool, all other leads can  
be soldered in one operation within 2 to 5 seconds  
between 270 and 320 °C.  
Typical dwell time of the leads in the wave ranges from  
3 to 4 seconds at 250 °C or 265 °C, depending on solder  
material applied, SnPb or Pb-free respectively.  
A mildly-activated flux will eliminate the need for removal  
of corrosive residues in most applications.  
2004 Jun 29  
38  

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