TDA9817T

更新时间： 2024-01-13 06:40:59

品牌	Logo	应用领域
恩智浦 - NXP		消费电路商用集成电路接收器集成电路光电二极管
页数	文件大小	规格书
41页	234K
描述
Single/multistandard VIF/SIF-PLL and FM-PLL/AM demodulators

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中文翻译

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技术参数
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TDA9817T 技术参数

是否Rohs认证：	符合	生命周期：	Transferred
包装说明：	SSOP, SSOP24,.3	Reach Compliance Code：	unknown
风险等级：	5.68	Is Samacsys：	N
JESD-30 代码：	R-PDSO-G24	端子数量：	24
最高工作温度：	70 °C	最低工作温度：	-20 °C
封装主体材料：	PLASTIC/EPOXY	封装代码：	SSOP
封装等效代码：	SSOP24,.3	封装形状：	RECTANGULAR
封装形式：	SMALL OUTLINE, SHRINK PITCH	电源：	5 V
认证状态：	Not Qualified	子类别：	Other Consumer ICs
最大压摆率：	104 mA	表面贴装：	YES
技术：	BIPOLAR	温度等级：	COMMERCIAL
端子形式：	GULL WING	端子节距：	0.635 mm
端子位置：	DUAL	Base Number Matches：	1

TDA9817T 数据手册

Philips Semiconductors

Product speciﬁcation

Single/multistandard VIF/SIF-PLL and

FM-PLL/AM demodulators

TDA9817; TDA9818

SOLDERING

Introduction

type oven. Throughput times (preheating, soldering and

cooling) vary between 100 and 200 seconds depending

on heating method.

This text gives a very brief insight to a complex technology.

A more in-depth account of soldering ICs can be found in

our “Data Handbook IC26; Integrated Circuit Packages”

(document order number 9398 652 90011).

Typical reflow peak temperatures range from

215 to 270 °C depending on solder paste material. The

top-surface temperature of the packages should

preferably be kept:

There is no soldering method that is ideal for all IC

packages. Wave soldering is often preferred when

through-hole and surface mount components are mixed on

one printed-circuit board. Wave soldering can still be used

for certain surface mount ICs, but it is not suitable for fine

pitch SMDs. In these situations reflow soldering is

recommended. Driven by legislation and environmental

forces the worldwide use of lead-free solder pastes is

increasing.

• below 225 °C (SnPb process) or below 245 °C (Pb-free

process)

– for all the BGA, HTSSON..T and SSOP-T packages

– for packages with a thickness ≥ 2.5 mm

– for packages with a thickness < 2.5 mm and a

volume ≥ 350 mm³so called thick/large packages.

• below 240 °C (SnPb process) or below 260 °C (Pb-free

process) for packages with a thickness < 2.5 mm and a

volume < 350 mm³so called small/thin packages.

Through-hole mount packages

Moisture sensitivity precautions, as indicated on packing,

must be respected at all times.

SOLDERING BY DIPPING OR BY SOLDER WAVE

Typical dwell time of the leads in the wave ranges from

3 to 4 seconds at 250 °C or 265 °C, depending on solder

material applied, SnPb or Pb-free respectively.

WAVE SOLDERING

Conventional single wave soldering is not recommended

for surface mount devices (SMDs) or printed-circuit boards

with a high component density, as solder bridging and

non-wetting can present major problems.

The total contact time of successive solder waves must not

exceed 5 seconds.

The device may be mounted up to the seating plane, but

the temperature of the plastic body must not exceed the

specified maximum storage temperature (T_stg(max)). If the

printed-circuit board has been pre-heated, forced cooling

may be necessary immediately after soldering to keep the

temperature within the permissible limit.

To overcome these problems the double-wave soldering

method was specifically developed.

If wave soldering is used the following conditions must be

observed for optimal results:

• Use a double-wave soldering method comprising a

turbulent wave with high upward pressure followed by a

smooth laminar wave.

MANUAL SOLDERING

Apply the soldering iron (24 V or less) to the lead(s) of the

package, either below the seating plane or not more than

2 mm above it. If the temperature of the soldering iron bit

is less than 300 °C it may remain in contact for up to

10 seconds. If the bit temperature is between

• For packages with leads on two sides and a pitch (e):

– larger than or equal to 1.27 mm, the footprint

longitudinal axis is preferred to be parallel to the

transport direction of the printed-circuit board;

300 and 400 °C, contact may be up to 5 seconds.

– smaller than 1.27 mm, the footprint longitudinal axis

must be parallel to the transport direction of the

printed-circuit board.

Surface mount packages

REFLOW SOLDERING

The footprint must incorporate solder thieves at the

downstream end.

Reflow soldering requires solder paste (a suspension of

fine solder particles, flux and binding agent) to be applied

to the printed-circuit board by screen printing, stencilling or

pressure-syringe dispensing before package placement.

• For packages with leads on four sides, the footprint must

be placed at a 45° angle to the transport direction of the

printed-circuit board. The footprint must incorporate

solder thieves downstream and at the side corners.

Several methods exist for reflowing; for example,

convection or convection/infrared heating in a conveyor

2004 Jun 29

1...34 35 363738 39 40 41

中文翻译

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与TDA9817T相关器件

型号	品牌	获取价格	描述	数据表
TDA9817TS	NXP	获取价格	Single/multistandard VIF/SIF-PLL and FM-PLL/AM demodulators
TDA9818	NXP	获取价格	Single/multistandard VIF/SIF-PLL and FM-PLL/AM demodulators
TDA9818T	NXP	获取价格	Single/multistandard VIF/SIF-PLL and FM-PLL/AM demodulators
TDA9818TS	NXP	获取价格	Single/multistandard VIF/SIF-PLL and FM-PLL/AM demodulators
TDA9819	NXP	获取价格	Multistandard vision and sound-IF PLL with DVB-IF processing
TDA9819T	NXP	获取价格	Multistandard vision and sound-IF PLL with DVB-IF processing
TDA9819TD-T	NXP	获取价格	IC SPECIALTY CONSUMER CIRCUIT, PDSO32, Consumer IC:Other
TDA9820	NXP	获取价格	Multistandard/dual channel TV FM intercarrier sound demodulator
TDA9820T	NXP	获取价格	Multistandard/dual channel TV FM intercarrier sound demodulator
TDA9821	NXP	获取价格	Dual channel TV FM intercarrier sound demodulator

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