TDA8742

更新时间： 2024-02-18 09:21:49

品牌	Logo	应用领域
恩智浦 - NXP		消费电路商用集成电路接收器集成电路光电二极管
页数	文件大小	规格书
21页	284K
描述
Satellite sound circuit with noise reduction

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中文翻译

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技术参数
数据手册

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TDA8742 技术参数

生命周期：	Obsolete	包装说明：	QFP,
Reach Compliance Code：	unknown	风险等级：	5.7
商用集成电路类型：	AUDIO DEMODULATOR	解调类型：	FM
谐波失真：	0.1%	JESD-30 代码：	S-PQFP-G44
长度：	10 mm	功能数量：	1
端子数量：	44	最高工作温度：	70 °C
最低工作温度：	-20 °C	封装主体材料：	PLASTIC/EPOXY
封装代码：	QFP	封装形状：	SQUARE
封装形式：	FLATPACK	认证状态：	Not Qualified
座面最大高度：	2.1 mm	信噪比Nom（FM）：	70 dB
最大压摆率：	45 mA	最大供电电压 (Vsup)：	13.2 V
最小供电电压 (Vsup)：	8 V	表面贴装：	YES
温度等级：	COMMERCIAL	端子形式：	GULL WING
端子节距：	0.8 mm	端子位置：	QUAD
宽度：	10 mm	Base Number Matches：	1

TDA8742 数据手册

Philips Semiconductors

Product speciﬁcation

Satellite sound circuit with noise reduction

TDA8742; TDA8742H

SOLDERING

BY SOLDER PASTE REFLOW

Reflow soldering requires the solder paste (a suspension

of fine solder particles, flux and binding agent) to be

applied to the substrate by screen printing, stencilling or

pressure-syringe dispensing before device placement.

Plastic dual in-line packages

BY DIP OR WAVE

The maximum permissible temperature of the solder is

260 °C; this temperature must not be in contact with the

joint for more than 5 s. The total contact time of successive

solder waves must not exceed 5 s.

Several techniques exist for reflowing; for example,

thermal conduction by heated belt, infrared, and

vapour-phase reflow. Dwell times vary between 50 and

300 s according to method. Typical reflow temperatures

range from 215 to 250 °C.

The device may be mounted up to the seating plane, but

the temperature of the plastic body must not exceed the

specified storage maximum. If the printed-circuit board has

been pre-heated, forced cooling may be necessary

immediately after soldering to keep the temperature within

the permissible limit.

Preheating is necessary to dry the paste and evaporate

the binding agent. Preheating duration: 45 min at 45 °C.

REPAIRING SOLDERED JOINTS (BY HAND-HELD SOLDERING

IRON OR PULSE-HEATED SOLDER TOOL)

REPAIRING SOLDERED JOINTS

Fix the component by first soldering two, diagonally

opposite, end pins. Apply the heating tool to the flat part of

the pin only. Contact time must be limited to 10 s at up to

300 °C. When using proper tools, all other pins can be

soldered in one operation within 2 to 5 s at between 270

and 320 °C. (Pulse-heated soldering is not recommended

for SO packages.)

Apply the soldering iron below the seating plane (or not

more than 2 mm above it). If its temperature is below

300 °C, it must not be in contact for more than 10 s; if

between 300 and 400 °C, for not more than 5 s.

Plastic quad ﬂat packages

BY WAVE

For pulse-heated solder tool (resistance) soldering of VSO

packages, solder is applied to the substrate by dipping or

by an extra thick tin/lead plating before package

placement.

During placement and before soldering, the component

must be fixed with a droplet of adhesive. After curing the

adhesive, the component can be soldered. The adhesive

can be applied by screen printing, pin transfer or syringe

dispensing.

Maximum permissible solder temperature is 260 °C, and

maximum duration of package immersion in solder bath is

10 s, if allowed to cool to less than 150 °C within 6 s.

Typical dwell time is 4 s at 250 °C.

A modified wave soldering technique is recommended

using two solder waves (dual-wave), in which a turbulent

wave with high upward pressure is followed by a smooth

laminar wave. Using a mildly-activated flux eliminates the

need for removal of corrosive residues in most

applications.

October 1994

1...17 18 192021

中文翻译

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与TDA8742相关器件

型号	品牌	描述	获取价格	数据表
TDA8742H	NXP	Satellite sound circuit with noise reduction	获取价格
TDA8745	NXP	Satellite sound receiver with I2C-bus control	获取价格
TDA8745H	NXP	Satellite sound receiver with I2C-bus control	获取价格
TDA8745HB-S	ETC	TV/Video Sound Circuit	获取价格
TDA8745H-T	NXP	暂无描述	获取价格
TDA8745N	NXP	IC SPECIALTY CONSUMER CIRCUIT, PDIP42, Consumer IC:Other	获取价格

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