Datasheet > TDA3866

TDA3866

更新时间： 2024-02-29 04:08:27

品牌	Logo	应用领域
恩智浦 - NXP		/
页数	文件大小	规格书
16页	135K
描述
Quasi-split sound processor for all standards

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数据手册

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TDA3866 数据手册

Philips Semiconductors

Preliminary speciﬁcation

Quasi-split sound processor for all standards

TDA3866

PACKAGE OUTLINE

SDIP24: plastic shrink dual in-line package; 24 leads (400 mil)

SOT234-1

(e )

w M

pin 1 index

10 mm

scale

DIMENSIONS (mm are the original dimensions)

(1)

max.

(1)

UNIT

min.

max.

1.3

0.8

0.53

0.40

0.32

0.23

22.3

21.4

9.1

8.7

3.2

2.8

10.7

10.2

12.2

10.5

4.7

0.51

3.8

1.778

10.16

0.18

1.6

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

REFERENCES

OUTLINE

EUROPEAN

PROJECTION

ISSUE DATE

VERSION

IEC

JEDEC

EIAJ

92-11-17

95-02-04

SOT234-1

January 1992

1...12 13 141516

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