TDA1547PN

更新时间： 2024-01-10 01:17:48

品牌	Logo	应用领域
恩智浦 - NXP		转换器数模转换器光电二极管
页数	文件大小	规格书
18页	138K
描述
IC DUAL, SERIAL INPUT LOADING, 1-BIT DAC, PDIP32, PLASTIC, SOT-232A, SDIP-32, Digital to Analog Converter

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TDA1547PN 技术参数

生命周期：	Obsolete	零件包装代码：	DIP
包装说明：	SDIP,	针数：	32
Reach Compliance Code：	unknown	风险等级：	5.82
Is Samacsys：	N	转换器类型：	D/A CONVERTER
输入位码：	BINARY	输入格式：	SERIAL
JESD-30 代码：	R-PDIP-T32	标称负供电电压：	-5 V
位数：	1	功能数量：	2
端子数量：	32	最高工作温度：	70 °C
最低工作温度：	-20 °C	封装主体材料：	PLASTIC/EPOXY
封装代码：	SDIP	封装形状：	RECTANGULAR
封装形式：	IN-LINE, SHRINK PITCH	认证状态：	Not Qualified
座面最大高度：	4.7 mm	最大压摆率：	46 mA
标称供电电压：	5 V	表面贴装：	NO
技术：	BICMOS	温度等级：	COMMERCIAL
端子形式：	THROUGH-HOLE	端子节距：	1.778 mm
端子位置：	DUAL	宽度：	10.16 mm
Base Number Matches：	1

TDA1547PN 数据手册

Philips Semiconductors

Product speciﬁcation

Dual top-performance bitstream DAC

TDA1547

The device may be mounted up to the seating plane, but

the temperature of the plastic body must not exceed the

specified maximum storage temperature (T_{stg max}). If the

printed-circuit board has been pre-heated, forced cooling

may be necessary immediately after soldering to keep the

temperature within the permissible limit.

SOLDERING

Introduction

There is no soldering method that is ideal for all IC

packages. Wave soldering is often preferred when

through-hole and surface mounted components are mixed

on one printed-circuit board. However, wave soldering is

not always suitable for surface mounted ICs, or for

printed-circuits with high population densities. In these

situations reflow soldering is often used.

Repairing soldered joints

Apply a low voltage soldering iron (less than 24 V) to the

lead(s) of the package, below the seating plane or not

more than 2 mm above it. If the temperature of the

soldering iron bit is less than 300 °C it may remain in

contact for up to 10 seconds. If the bit temperature is

between 300 and 400 °C, contact may be up to 5 seconds.

This text gives a very brief insight to a complex technology.

A more in-depth account of soldering ICs can be found in

our “IC Package Databook” (order code 9398 652 90011).

Soldering by dipping or by wave

The maximum permissible temperature of the solder is

260 °C; solder at this temperature must not be in contact

with the joint for more than 5 seconds. The total contact

time of successive solder waves must not exceed

5 seconds.

DEFINITIONS

Data sheet status

Objective speciﬁcation

Preliminary speciﬁcation

Product speciﬁcation

This data sheet contains target or goal speciﬁcations for product development.

This data sheet contains preliminary data; supplementary data may be published later.

This data sheet contains ﬁnal product speciﬁcations.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or

more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation

of the device at these or at any other conditions above those given in the Characteristics sections of the speciﬁcation

is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the speciﬁcation.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these

products can reasonably be expected to result in personal injury. Philips customers using or selling these products for

use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such

improper use or sale.

September 1991

1...15 16 1718

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