P-Channel Enhancement Mode MOSFET
TBSS84ES TBSS84ESW TBSS84EST TBSS84ESL
Electrical Characteristics (@ TA = 25°C unless otherwise specified)
Symbol
Parameter
Test Condition
Min.
Typ. Max. Unit
Static Characteristics
VDSS
IDSS
IGSS
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Body Leakage Current
VGS = 0V, ID = -250μA
VDS = -50V, VGS = 0V
VGS = ±20V, VDS = 0V
-50
-
-
-
-
V
-
-
-1
μA
μA
±1 0
On Characteristics *2
VGS = -5V, ID = -0.1A
VGS = -10V, ID = -0.13A
VDS = VGS, ID = -250μA
-
-
2.4
2.0
8
6
RDS(ON) Static Drain-Source On-resistance
Ω
VGS(TH)
Gate Threshold Voltage
-1
-1.5
-2
V
Dynamic Characteristics *3
CISS
COSS
CRSS
RG
Input Capacitance
-
-
-
-
53
11
5
-
-
-
-
VGS = 0V
Output Capacitance
Reverse Transfer Capacitance
Gate Resistance
VDS = -20V
f = 1.0MHz
pF
f = 1.0MHz, VGS = 0V
721
Ω
Switching Characteristics
td(ON)
tr
td(OFF)
tf
Turn-on Delay Time
Turn-on Rise Time
-
-
-
-
-
-
-
2.5
1
-
-
-
-
-
-
-
VDS = -15V
RL = -50Ω
ID = -2.5A
ns
Turn-Off Delay Time
Turn-Off Fall Time
16
8
QG
Total Gate-Charge
2.5
0.83
0.82
VDS = -25V
VGS = -4.5V
ID = -0.2A
QGS
QGD
Gate to Source Charge
Gate to Drain (Miller) Charge
nC
Source-Drain Diode Characteristics
VSD
IS
Diode Forward Voltage *2
Continuous Source Current
Pulsed Source Current
IS = -0.26A, VGS = 0 V
TC = 25°C
-0.9
-1.4
-0.13
-0.52
V
A
A
-
-
-
-
-
ISM
TC = 25°C
Notes:
1、 Surface mounted on FR4 board, and standard footprint, t ≤ 10 sec
2、 Pulse test: pulse width ≤ 300µs, duty cycle ≤ 2%
3、 Guaranteed by design, not subject to production
4、 Pulse width limited by maximum junction temperature
MTM0133A: April 2022
www.gmesemi.com
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