5秒后页面跳转
捷配首页

Datasheet > 消费电路 > 其他商用集成电路> TAS3208PZPR
TAS3208PZPR PDF预览

TAS3208PZPR

更新时间： 2024-02-22 06:59:59
品牌 Logo 应用领域
德州仪器 - TI 消费电路商用集成电路
页数 文件大小 规格书
9页 222K
描述
DIGITAL AUDIO PROCESSOR WITH ANALOG INTERFACE

阅读下载

获取价格

TAS3208PZPR 技术参数

是否无铅： 含铅是否Rohs认证： 符合
生命周期：Obsolete零件包装代码：QFP
包装说明：HTFQFP, TQFP100,.63SQ针数：100
Reach Compliance Code：compliantHTS代码：8542.39.00.01
风险等级：5.14Is Samacsys：N
商用集成电路类型：CONSUMER CIRCUITJESD-30 代码：S-PQFP-G100
JESD-609代码：e4长度：14 mm
湿度敏感等级：3功能数量：1
端子数量：100最高工作温度：70 °C
最低工作温度：-20 °C封装主体材料：PLASTIC/EPOXY
封装代码：HTFQFP封装等效代码：TQFP100,.63SQ
封装形状：SQUARE封装形式：FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH
峰值回流温度（摄氏度）：260电源：3.3 V
认证状态：Not Qualified座面最大高度：1.2 mm
子类别：Other Consumer ICs最大压摆率：200 mA
最大供电电压 (Vsup)：3.6 V最小供电电压 (Vsup)：3 V
表面贴装：YES温度等级：OTHER
端子面层：Nickel/Palladium/Gold (Ni/Pd/Au)端子形式：GULL WING
端子节距：0.5 mm端子位置：QUAD
处于峰值回流温度下的最长时间：NOT SPECIFIED宽度：14 mm
Base Number Matches：1

TAS3208PZPR 数据手册

 浏览型号TAS3208PZPR的Datasheet PDF文件第3页浏览型号TAS3208PZPR的Datasheet PDF文件第4页浏览型号TAS3208PZPR的Datasheet PDF文件第5页浏览型号TAS3208PZPR的Datasheet PDF文件第6页浏览型号TAS3208PZPR的Datasheet PDF文件第8页浏览型号TAS3208PZPR的Datasheet PDF文件第9页 
PACKAGE OPTION ADDENDUM  
www.ti.com  
7-Mar-2007  
PACKAGING INFORMATION  
Orderable Device  
TAS3208PZP  
Status (1)  
ACTIVE  
ACTIVE  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
HTQFP  
PZP  
100  
90 Green (RoHS & CU NIPDAU Level-3-260C-168 HR  
no Sb/Br)  
TAS3208PZPR  
HTQFP  
PZP  
100  
1000 Green (RoHS & CU NIPDAU Level-3-260C-168 HR  
no Sb/Br)  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and  
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS  
compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 1  
1...456789

下载PDF

与TAS3208PZPR相关器件

型号 品牌 描述 获取价格 数据表
TAS3208YZPR TI DIGITAL AUDIO PROCESSOR WITH ANALOG INTERFACE

获取价格
TAS3218 TI DIGITAL AUDIO PROCESSOR WITH ANALOG INTERFACE

获取价格
TAS3218_1 TI DIGITAL AUDIO PROCESSOR WITH ANALOG INTERFACE

获取价格
TAS3218IPZP TI DIGITAL AUDIO PROCESSOR WITH ANALOG INTERFACE

获取价格
TAS3218IPZPR TI DIGITAL AUDIO PROCESSOR WITH ANALOG INTERFACE

获取价格
TAS3218PZP TI DIGITAL AUDIO PROCESSOR WITH ANALOG INTERFACE

获取价格

与TAS3208PZPR相关文章

您还可以找


热门产品
PCB打样/小批量
铝基板
BOM智能配单
PCBA制造
钣金
精密CNC
模具注塑
薄膜开关
精选活动
PCBA打样特惠
四六层板品质升级
铝基板品质升级
一体化电子制造
DFM下载
服务支持
企业认证
产品展示
工厂展示
工艺能力
积分商城
关于捷配
捷配简介
企业文化
公司动态
人才招聘
联系我们
帮助中心
下单流程
付款流程
开票流程
常见问题
全球PCB制造服务专线 400-613-0088

工作时间：9:00-21:00

CEO邮箱：ceo@jiepei.com

投诉邮箱：tousu@jiepei.com

捷配网-微信公众号 微信公众号
捷配网-微信公众号 抖音公众号
资质认证：
合作快递：
支付方式：
Copyright © 2024 Jiepei.com Inc. All Rights Reserved. 版权所有:杭州捷配信息科技有限公司 浙公网安备 33010502006866号 浙ICP备10014259号-119 营业执照ICP证