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TA8271HQ PDF预览

TA8271HQ

更新时间: 2024-01-07 21:55:59
品牌 Logo 应用领域
东芝 - TOSHIBA 消费电路商用集成电路音频放大器视频放大器局域网
页数 文件大小 规格书
12页 251K
描述
Max Power 41 W BTL X 4 ch Audio Power IC

TA8271HQ 技术参数

是否Rohs认证:不符合生命周期:Obsolete
零件包装代码:ZIP包装说明:1 MM PITCH, PLASTIC, HZIP-25
针数:25Reach Compliance Code:unknown
ECCN代码:EAR99HTS代码:8542.33.00.01
风险等级:5.87Is Samacsys:N
标称带宽:20 kHz商用集成电路类型:AUDIO AMPLIFIER
增益:34 dB谐波失真:10%
JESD-30 代码:R-PZFM-T25信道数量:4
功能数量:1端子数量:25
最高工作温度:85 °C最低工作温度:-40 °C
标称输出功率:24 W封装主体材料:PLASTIC/EPOXY
封装代码:ZIP封装等效代码:ZIP25,.16,.16,40
封装形状:RECTANGULAR封装形式:FLANGE MOUNT
峰值回流温度(摄氏度):NOT SPECIFIED电源:13.2 V
认证状态:Not Qualified子类别:Audio/Video Amplifiers
最大压摆率:400 mA最大供电电压 (Vsup):18 V
最小供电电压 (Vsup):9 V表面贴装:NO
技术:BIPOLAR温度等级:INDUSTRIAL
端子形式:THROUGH-HOLE端子节距:1 mm
端子位置:ZIG-ZAG处于峰值回流温度下的最长时间:NOT SPECIFIED
Base Number Matches:1

TA8271HQ 数据手册

 浏览型号TA8271HQ的Datasheet PDF文件第6页浏览型号TA8271HQ的Datasheet PDF文件第7页浏览型号TA8271HQ的Datasheet PDF文件第8页浏览型号TA8271HQ的Datasheet PDF文件第9页浏览型号TA8271HQ的Datasheet PDF文件第10页浏览型号TA8271HQ的Datasheet PDF文件第11页 
TA8271HQ  
About solderability, following conditions were confirmed  
Solderability  
(1) Use of Sn-63Pb solder Bath  
· solder bath temperature = 230°C  
· dipping time = 5 seconds  
· the number of times = once  
· use of R-type flux  
(2) Use of Sn-3.0Ag-0.5Cu solder Bath  
· solder bath temperature = 245°C  
· dipping time = 5 seconds  
· the number of times = once  
· use of R-type flux  
RESTRICTIONS ON PRODUCT USE  
030619EBF  
The information contained herein is subject to change without notice.  
The information contained herein is presented only as a guide for the applications of our products. No  
responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which  
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of  
TOSHIBA or others.  
TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor  
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical  
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of  
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of  
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.  
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as  
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and  
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability  
Handbook” etc..  
The TOSHIBA products listed in this document are intended for usage in general electronics applications  
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,  
etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires  
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or  
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or  
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,  
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this  
document shall be made at the customer’s own risk.  
The products described in this document are subject to the foreign exchange and foreign trade laws.  
TOSHIBA products should not be embedded to the downstream products which are prohibited to be produced  
and sold, under any law and regulations.  
This product generates heat during normal operation. However, substandard performance or malfunction may  
cause the product and its peripherals to reach abnormally high temperatures.  
The product is often the final stage (the external output stage) of a circuit. Substandard performance or  
malfunction of the destination device to which the circuit supplies output may cause damage to the circuit or to the  
product.  
12  
2004-05-10  

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