SAMWIN
SW840
General Description
Features
This power MOSFET is produced with advanced
VDMOS process, planar stripe. This technology enable
power MOSFET to have better characteristics, such as
fast switching time, low on resistance, low gate charge
and especially excellent avalanche characteristics. This
power MOSFET is usually used at high efficient DC to
DC converter block, high efficiency switch mode power
supplies, power factor correction, electronic lamp ballast
based on half bridge.
N-Channel MOSFET
BVDSS (Minimum)
RDS(ON) (Maximum)
ID
Qg (Typical)
PD (@TC=25
: 500 V
: 0.85 ohm
: 8.5 A
: 36 nc
: 125 W
)
D
G
S
Absolute Maximum Ratings
Symbol
Parameter
Value
500
8.5
Units
V
VDSS
Drain to Source Voltage
Continuous Drain Current (@Tc=25
Continuous Drain Current (@Tc=100
Drain Current Pulsed
)
A
ID
)
6.2
A
IDM
VGS
(Note 1)
34
A
Gate to Source Voltage
30
V
EAS
Single Pulsed Avalanche Energy
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
(Note 2)
(Note 1)
(Note 3)
360
12.5
4.5
mJ
mJ
V/ns
W
EAR
dv/dt
Total Power Dissipation (@Tc=25
Derating Factor above 25
)
125
1.18
P D
W/
TSTG,TJ
TL
Operating junction temperature &Storage temperature
-55~+150
300
Maximum Lead Temperature for soldering purpose, 1/8 from Case
for 5 seconds.
Thermal Characteristics
Value
Units
Symbol
Parameter
Min
Typ
Max
R
R
R
Thermal Resistance, Junction-to-Case
Thermal Resistance, Case-to-Sink
-
-
-
-
0.5
-
1.0
-
/ W
/ W
/ W
JC
CS
JA
Thermal Resistance, Junction-to-Ambient
62.5
1/6
REV0.1
04.10.15