SW110R03VT
Electrical characteristic ( TJ = 25oC unless otherwise specified )
Symbol
Parameter
Test conditions
Min.
Typ.
Max. Unit
Off characteristics
BVDSS
Drain to source breakdown voltage
VGS=0V, ID=250uA
30
V
ΔBVDSS Breakdown voltage temperature
ID=250uA, referenced to 25oC
0.02
V/oC
/ ΔTJ
coefficient
VDS=30V, VGS=0V
VDS=24V, TJ=125oC
VGS=20V, VDS=0V
VGS=-20V, VDS=0V
1
uA
uA
nA
nA
IDSS
Drain to source leakage current
50
Gate to source leakage current, forward
Gate to source leakage current, reverse
100
-100
IGSS
On characteristics
VGS(TH)
RDS(ON)
Gfs
Gate threshold voltage
VDS=VGS, ID=250uA
1
2
V
VGS=4.5V, ID=6A,TJ=25oC
VGS=10V, ID=6A,TJ=25oC
VGS=4.5V, ID=6A,TJ=125oC
VGS=10V, ID=6A,TJ=125oC
VDS=10V, ID=6A
9.8
8.3
11.5
9.5
mΩ
mΩ
mΩ
mΩ
S
Drain to source on state resistance
Forward transconductance
13.7
11.6
31
Dynamic characteristics
Ciss
Coss
Crss
td(on)
tr
Input capacitance
1127
173
125
3
Output capacitance
Reverse transfer capacitance
Turn on delay time
Rising time
VGS=0V, VDS=15V, f=1MHz
pF
ns
VDS=15V, ID=8A, RG=4.7Ω,
VGS=10V
30
32
10
24
2
td(off)
tf
Turn off delay time
Fall time
(note 4,5)
Qg
Total gate charge
Gate-source charge
Gate-drain charge
Gate resistance
VDS=24V, VGS=10V, ID=8A
IG=4mA
Qgs
Qgd
Rg
nC
(note 4,5)
6
VDS=0V, Scan F mode
3
Ω
Source to drain diode ratings characteristics
Symbol
IS
Parameter
Continuous source current
Pulsed source current
Test conditions
Min.
Typ.
Max. Unit
11
44
A
A
Integral reverse p-n Junction
diode in the MOSFET
ISM
VSD
trr
Diode forward voltage drop.
Reverse recovery time
IS=11A, VGS=0V
1.4
V
7
2
ns
nC
IS=8A, VGS=0V,
dIF/dt=100A/us
Qrr
Reverse recovery charge
※. Notes
1.
2.
3.
4.
5.
Repeatitive rating : pulse width limited by junction temperature.
L =0.5mH, IAS =15A, VDD =10V, RG=25Ω, Starting TJ = 25oC
ISD ≤ 8A, di/dt = 100A/us, VDD ≤ BVDSS, Staring TJ =25oC
Pulse Test : Pulse Width ≤ 300us, duty cycle ≤ 2%
Essentially independent of operating temperature.
Copyright@ SEMIPOWER Electronic Technology Co., Ltd. All rights reserved.
Aug. 2019. Rev. 2.0
2/6