SVF9N90T/SVF9N90F
Pb
SVF9N90T/SVF9N90F
Pb Free Plating Product
ThinkiSemi 8.0A,900V Planar N-Channel Power MOSFETs
2. Drain
{
BV
R
= 900V
DSS
●
Features
= 1.40ohm
◀
▲
DS(ON)
●
●
{
1. Gate
■ Low RDS(on) (1.40 Ω )@VGS=10V,ID=4A
■ Low Gate Charge (Typical 45nC)
■ Low Crss (Typical 14pF)
I = 8.0A(9.0A Max.)
D
{
3. Source
TO-220F-3L
(SVF9N90F)
TO-220C-3L
(SVF9N90T)
■ Improved dv/dt Capability
■ 100% Avalanche Tested
■ Maximum Junction Temperature Range (150°C)
3
3
2
1
2
1
General Description
This Power MOSFET is produced using ThinkiSemi's advanced
planar stripe, DMOS technology. This latest technology has been
especially designed to minimize on-state resistance, have a low
gate charge with superior switching performance, and rugged
avalanche characteristics. This Power MOSFET is well suited
for synchronous DC-DC Converters and Power Management in
portable and battery operated products.
Absolute Maximum Ratings TC = 25°C unless otherwise noted
Symbol
Parameter
SVF9N90T
SVF9N90F
Unit
V
V
I
Drain-Source Voltage
900
DSS
- Continuous (T = 25°C)
Drain Current
8.0
2.8
32
8.0 *
2.8 *
32 *
A
D
C
- Continuous (T = 100°C)
A
C
I
(Note 1)
Drain Current
- Pulsed
A
DM
V
E
I
Gate-Source Voltage
± 30
900
8.0
V
GSS
AS
(Note 2)
(Note 1)
(Note 1)
(Note 3)
Single Pulsed Avalanche Energy
Avalanche Current
mJ
A
AR
E
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
20.5
4.0
mJ
V/ns
W
AR
dv/dt
P
Power Dissipation (T = 25°C)
205
68
D
C
- Derate above 25°C
Operating and Storage Temperature Range
1.64
0.54
W/°C
°C
T , T
-55 to +150
300
J
STG
Maximum lead temperature for soldering purposes,
T
°C
L
1/8" from case for 5 seconds
* Drain current limited by maximum junction temperature
Thermal Characteristics
Symbol
Parameter
Unit
SVF9N90T
SVF9N90F
R
R
R
Thermal Resistance, Junction-to-Case
Thermal Resistance, Case-to-Sink Typ.
Thermal Resistance, Junction-to-Ambient
0.61
1.85
°C/W
°C/W
°C/W
θJC
0.5
--
θJS
62.5
62.5
θJA
Page 1/8
http://www.thinkisemi.com.tw/
Rev.10T
© 1995 Thinki Semiconductor Co., Ltd.