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STM8S00XF3U6TR

更新时间: 2024-02-11 10:16:44
品牌 Logo 应用领域
意法半导体 - STMICROELECTRONICS 可编程只读存储器电动程控只读存储器电可擦编程只读存储器
页数 文件大小 规格书
100页 956K
描述
Value line, 16 MHz STM8S 8-bit MCU, 8 Kbytes Flash, 128 bytes data EEPROM, 10-bit ADC, 3 timers, UART, SPI, I²C

STM8S00XF3U6TR 数据手册

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Thermal characteristics  
STM8S003K3 STM8S003F3  
11  
Thermal characteristics  
The maximum chip junction temperature (TJ max) must never exceed the values given in  
Operating conditions.  
The maximum chip-junction temperature, TJmax, in degrees Celsius, may be calculated using  
the following equation:  
TJmax = TAmax + (PDmax x ΘJA)  
Where:  
TAmax is the maximum ambient temperature in °C  
ΘJA is the package junction-to-ambient thermal resistance in °C/W  
PDmax is the sum of PINTmax and PI/Omax (PDmax = PINTmax + PI/Omax  
)
PINTmax is the product of IDD andVDD, expressed in Watts. This is the maximum chip internal  
power.  
PI/Omax represents the maximum power dissipation on output pins  
Where: PI/Omax =Σ (VOL*IOL) + Σ((VDD-VOH)*IOH), taking into account the actual VOL/IOL and  
VOH/IOH of the I/Os at low and high level in the application.  
Table 54: Thermal characteristics  
Symbol  
Parameter(1)  
Value  
Unit  
ΘJA  
ΘJA  
ΘJA  
Thermal resistance junction-ambient  
TSSOP20 - 4.4 mm  
84  
°C/W  
90  
60  
Thermal resistance junction-ambient  
UFQFPN20 - 3 x 3 mm  
Thermal resistance junction-ambient  
LQFP32 - 7 x 7 mm  
(1)Thermal resistances are based on JEDEC JESD51-2 with 4-layer PCB in a natural  
convection environment.  
11.1  
11.2  
Reference document  
JESD51-2 integrated circuits thermal test method environment conditions - natural convection  
(still air). Available from www.jedec.org.  
Selecting the product temperature range  
When ordering the microcontroller, the temperature range is specified in the order code.  
94/100  
DocID018576 Rev 3  
 

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