STM32F103ZCH6XXX PDF预览

STM32F103ZCH6XXX

更新时间: 2025-09-28 06:14:47
品牌 Logo 应用领域
意法半导体 - STMICROELECTRONICS 闪存通信
页数 文件大小 规格书
123页 1691K
描述
High-density performance line ARM-based 32-bit MCU with 256 to 512KB Flash, USB, CAN, 11 timers, 3 ADCs, 13 communication interfaces

STM32F103ZCH6XXX 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:BGA
包装说明:LFBGA, BGA144,12X12,32针数:100
Reach Compliance Code:compliantHTS代码:8542.31.00.01
风险等级:5.11具有ADC:YES
地址总线宽度:24位大小:32
边界扫描:YESCPU系列:CORTEX-M3
最大时钟频率:16 MHzDAC 通道:YES
DMA 通道:YES外部数据总线宽度:16
格式:FIXED POINT集成缓存:NO
JESD-30 代码:S-PBGA-B144长度:10 mm
低功率模式:YESDMA 通道数量:12
外部中断装置数量:16I/O 线路数量:112
端子数量:144片上程序ROM宽度:8
最高工作温度:85 °C最低工作温度:-40 °C
PWM 通道:YES封装主体材料:PLASTIC/EPOXY
封装代码:LFBGA封装等效代码:BGA144,12X12,32
封装形状:SQUARE封装形式:GRID ARRAY, LOW PROFILE, FINE PITCH
认证状态:Not QualifiedRAM(字节):49152
ROM(单词):262144ROM可编程性:FLASH
座面最大高度:1.7 mm速度:72 MHz
最大压摆率:69 mA最大供电电压:3.6 V
最小供电电压:2 V标称供电电压:3.3 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子形式:BALL
端子节距:0.8 mm端子位置:BOTTOM
宽度:10 mmuPs/uCs/外围集成电路类型:MICROCONTROLLER, RISC
Base Number Matches:1

STM32F103ZCH6XXX 数据手册

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Description  
STM32F103xC, STM32F103xD, STM32F103xE  
Figure 1.  
STM32F103xC, STM32F103xD and STM32F103xE performance line block diagram  
TRACECLK  
TRACED[0:3]  
as AS  
@V  
DD  
TPIU  
Trace/trig  
Trace  
controller  
Power  
Pbus  
Ibus  
V
SW/JTAG  
DD  
NJTRST  
JTDI  
JTCK/SWCLK  
JTMS/SWDIO  
JTDO  
Volt. reg.  
3.3 V to 1.8 V  
V
SS  
Flash 512 Kbytes  
64 bit  
Cortex-M3 CPU  
@V  
Supply  
DDA  
Dbus  
System  
as AF  
F
: 48/72 MHz  
max  
NRST  
supervision  
POR  
Reset  
V
POR /PDR  
DDA  
V
SRAM  
SSA  
@V  
DDA  
NVIC  
64 KB  
PVD  
Int  
RC 8 MHz  
RC 40 kHz  
PLL  
GP DMA1  
@V  
DD  
XTAL OSC  
4-16 MHz  
A[25:0]  
D[15:0]  
CLK  
NOE  
NWE  
OSC_IN  
OSC_OUT  
7 channels  
GP DMA2  
IWDG  
5 channels  
PCLK1  
PCLK2  
HCLK  
FCLK  
Reset &  
Clock  
control  
Standby  
interface  
NE[4:1]  
NBL[1:0]  
NWAIT  
NL (or NADV)  
as AF  
V
=1.8 V to 3.6 V  
BAT  
V
@
FSMC  
SDIO  
BAT  
OSC32_IN  
OSC32_OUT  
XTAL32kHz  
Backup  
TAMPER-RTC/  
ALARM/SECOND OUT  
RTC  
AWU  
reg  
D[7:0]  
CMD  
CK as AF  
Backup interface  
AHB2  
APB2  
AHB2  
APB1  
4 channels, ETR as AF  
4 channels, ETR as AF  
4 channels, ETR as AF  
4 channels as AF  
TIM2  
EXT.IT  
WKUP  
112AF  
PA[15:0]  
PB[15:0]  
TIM3  
TIM4  
GPIO port A  
GPIO port B  
GPIO port C  
TIM5  
RX, TX, CTS, RTS,  
CK as AF  
PC[15:0]  
PD[15:0]  
USART2  
USART3  
UART4  
UART5  
RX, TX, CTS, R T S,  
CK as AF  
GPIO port D  
GPIO port E  
PE[15:0]  
PF[15:0]  
PG[15:0]  
RX,TXasAF  
GPIO port F  
GPIO port G  
RX,TX asAF  
MOSI/SD, MISO  
SCK/CK, MCK, NSS/WS as AF  
SPI2/ I2S2  
4 channels  
3 compl. channels  
BKIN, ETR as AF  
4 channels  
3 compl. channels  
BKIN, ETR as AF  
TIM1  
MOSI/SD, MISO  
SCK/CK, MCK, NSS/WS as AF  
SPI3 / I2S3  
TIM8  
I2C1  
I2C2  
SCL, SDA, SMBA as AF  
SCL, SDA, SMBA as AF  
MOSI, MISO,  
SCK, NSS as AF  
SPI1  
SRAM 512 B  
bxCAN device  
RX, TX, CTS,  
RTS, CK as AF  
USART1  
WWDG  
USBDP/CAN_TX  
USBDM/CAN_RX  
USB 2.0 FS  
device  
Temp. sensor  
TIM6  
TIM7  
12bit DAC1  
12bit DAC 2  
IF  
DAC_OUT1 as AF  
DAC_OUT2 as AF  
8 ADC123_INs  
12-bit ADC1 IF  
12-bit ADC2 IF  
12-bit ADC3 IF  
common to the 3 ADCs  
8 ADC12_INs common  
to ADC1 & ADC2  
5 ADC3_INs on ADC3  
@V  
DDA  
VREF–  
VREF+  
@ V  
DDA  
ai14666f  
1. TA = –40 °C to +85 °C (suffix 6, see Table 71) or –40 °C to +105 °C (suffix 7, see Table 71), junction temperature up to  
105 °C or 125 °C, respectively.  
2. AF = alternate function on I/O port pin.  
12/123  
Doc ID 14611 Rev 7  

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