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STM32F103ZDH7XXX

更新时间： 2025-09-28 06:14:47
品牌 Logo 应用领域
意法半导体 - STMICROELECTRONICS 闪存通信
页数 文件大小 规格书
123页 1691K
描述
High-density performance line ARM-based 32-bit MCU with 256 to 512KB Flash, USB, CAN, 11 timers, 3 ADCs, 13 communication interfaces

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STM32F103ZDH7XXX 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：Active零件包装代码：BGA
包装说明：LFBGA, BGA144,12X12,32针数：100
Reach Compliance Code：compliantHTS代码：8542.31.00.01
风险等级：5.11具有ADC：YES
地址总线宽度：24位大小：32
边界扫描：YESCPU系列：CORTEX-M3
最大时钟频率：16 MHzDAC 通道：YES
DMA 通道：YES外部数据总线宽度：16
格式：FIXED POINT集成缓存：NO
JESD-30 代码：S-PBGA-B144长度：10 mm
低功率模式：YESDMA 通道数量：12
外部中断装置数量：16I/O 线路数量：112
端子数量：144片上程序ROM宽度：8
最高工作温度：105 °C最低工作温度：-40 °C
PWM 通道：YES封装主体材料：PLASTIC/EPOXY
封装代码：LFBGA封装等效代码：BGA144,12X12,32
封装形状：SQUARE封装形式：GRID ARRAY, LOW PROFILE, FINE PITCH
认证状态：Not QualifiedRAM（字节）：65536
ROM（单词）：393216ROM可编程性：FLASH
座面最大高度：1.7 mm速度：72 MHz
最大压摆率：70 mA最大供电电压：3.6 V
最小供电电压：2 V标称供电电压：3.3 V
表面贴装：YES技术：CMOS
温度等级：INDUSTRIAL端子形式：BALL
端子节距：0.8 mm端子位置：BOTTOM
宽度：10 mmuPs/uCs/外围集成电路类型：MICROCONTROLLER, RISC
Base Number Matches：1

STM32F103ZDH7XXX 数据手册

 浏览型号STM32F103ZDH7XXX的Datasheet PDF文件第2页浏览型号STM32F103ZDH7XXX的Datasheet PDF文件第3页浏览型号STM32F103ZDH7XXX的Datasheet PDF文件第4页浏览型号STM32F103ZDH7XXX的Datasheet PDF文件第5页浏览型号STM32F103ZDH7XXX的Datasheet PDF文件第6页浏览型号STM32F103ZDH7XXX的Datasheet PDF文件第7页 
STM32F103xC STM32F103xD  
STM32F103xE  
High-density performance line ARM-based 32-bit MCU with 256 to  
512KB Flash, USB, CAN, 11 timers, 3 ADCs, 13 communication interfaces  
Features  
FBGA  
■ Core: ARM 32-bit Cortex™-M3 CPU  
WLCSP64  
LQFP64 10 × 10 mm,  
– 72 MHz maximum frequency,  
LFBGA100 10 × 10 mm  
LQFP100 14 × 14 mm,  
LFBGA144 10 × 10 mm  
1.25 DMIPS/MHz (Dhrystone 2.1)  
LQFP144 20 × 20 mm  
performance at 0 wait state memory  
access  
■ Up to 112 fast I/O ports  
– 51/80/112 I/Os, all mappable on 16  
external interrupt vectors and almost all  
5 V-tolerant  
– Single-cycle multiplication and hardware  
division  
■ Memories  
■ Up to 11 timers  
– 256 to 512 Kbytes of Flash memory  
– up to 64 Kbytes of SRAM  
– Flexible static memory controller with 4  
Chip Select. Supports Compact Flash,  
SRAM, PSRAM, NOR and NAND memories  
– Up to four 16-bit timers, each with up to 4  
IC/OC/PWM or pulse counter and  
quadrature (incremental) encoder input  
– 2 × 16-bit motor control PWM timers with  
dead-time generation and emergency stop  
– LCD parallel interface, 8080/6800 modes  
– 2 × watchdog timers (Independent and  
Window)  
■ Clock, reset and supply management  
– 2.0 to 3.6 V application supply and I/Os  
– POR, PDR, and programmable voltage  
detector (PVD)  
– SysTick timer: a 24-bit downcounter  
– 2 × 16-bit basic timers to drive the DAC  
■ Up to 13 communication interfaces  
2
– 4-to-16 MHz crystal oscillator  
– Up to 2 × I C interfaces (SMBus/PMBus)  
– Internal 8 MHz factory-trimmed RC  
– Internal 40 kHz RC with calibration  
– 32 kHz oscillator for RTC with calibration  
– Up to 5 USARTs (ISO 7816 interface, LIN,  
IrDA capability, modem control)  
– Up to 3 SPIs (18 Mbit/s), 2 with I S  
interface multiplexed  
– CAN interface (2.0B Active)  
– USB 2.0 full speed interface  
– SDIO interface  
2
■ Low power  
– Sleep, Stop and Standby modes  
– V  
supply for RTC and backup registers  
BAT  
■ 3 × 12-bit, 1 µs A/D converters (up to 21  
■ CRC calculation unit, 96-bit unique ID  
channels)  
®
■ ECOPACK packages  
– Conversion range: 0 to 3.6 V  
– Triple-sample and hold capability  
– Temperature sensor  
Table 1.  
Device summary  
Part number  
Reference  
■ 2 × 12-bit D/A converters  
STM32F103RC STM32F103VC  
STM32F103ZC  
■ DMA: 12-channel DMA controller  
STM32F103xC  
STM32F103xD  
STM32F103xE  
– Supported peripherals: timers, ADCs, DAC,  
2
2
SDIO, I Ss, SPIs, I Cs and USARTs  
STM32F103RD STM32F103VD  
STM32F103ZD  
■ Debug mode  
STM32F103RE STM32F103ZE  
STM32F103VE  
– Serial wire debug (SWD) & JTAG interfaces  
– Cortex-M3 Embedded Trace Macrocell™  
September 2009  
Doc ID 14611 Rev 7  
1/123  
www.st.com  
1
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