STM32F101RCT6XXX PDF预览

STM32F101RCT6XXX

更新时间: 2025-07-23 06:14:43
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意法半导体 - STMICROELECTRONICS 闪存通信
页数 文件大小 规格书
106页 1388K
描述
High-density access line, ARM-based 32-bit MCU with 256 to 512 KB Flash, 9 timers, 1 ADC and 10 communication interfaces

STM32F101RCT6XXX 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:QFP
包装说明:LFQFP, QFP64,.47SQ,20针数:64
Reach Compliance Code:compliantHTS代码:8542.31.00.01
风险等级:5.66具有ADC:YES
地址总线宽度:位大小:32
CPU系列:CORTEX-M3最大时钟频率:16 MHz
DAC 通道:YESDMA 通道:YES
外部数据总线宽度:JESD-30 代码:S-PQFP-G64
JESD-609代码:e4长度:10 mm
湿度敏感等级:3I/O 线路数量:51
端子数量:64最高工作温度:85 °C
最低工作温度:-40 °CPWM 通道:YES
封装主体材料:PLASTIC/EPOXY封装代码:LFQFP
封装等效代码:QFP64,.47SQ,20封装形状:SQUARE
封装形式:FLATPACK, LOW PROFILE, FINE PITCH峰值回流温度(摄氏度):260
电源:2.5/3.3 V认证状态:Not Qualified
RAM(字节):32768ROM(单词):262144
ROM可编程性:FLASH座面最大高度:1.6 mm
速度:36 MHz子类别:Microcontrollers
最大压摆率:39 mA最大供电电压:3.6 V
最小供电电压:2 V标称供电电压:3.3 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子面层:Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式:GULL WING端子节距:0.5 mm
端子位置:QUAD处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:10 mmuPs/uCs/外围集成电路类型:MICROCONTROLLER, RISC
Base Number Matches:1

STM32F101RCT6XXX 数据手册

 浏览型号STM32F101RCT6XXX的Datasheet PDF文件第2页浏览型号STM32F101RCT6XXX的Datasheet PDF文件第3页浏览型号STM32F101RCT6XXX的Datasheet PDF文件第4页浏览型号STM32F101RCT6XXX的Datasheet PDF文件第5页浏览型号STM32F101RCT6XXX的Datasheet PDF文件第6页浏览型号STM32F101RCT6XXX的Datasheet PDF文件第7页 
STM32F101xC STM32F101xD  
STM32F101xE  
High-density access line, ARM-based 32-bit MCU with 256 to  
512 KB Flash, 9 timers, 1 ADC and 10 communication interfaces  
Features  
Core: ARM 32-bit Cortex™-M3 CPU  
– 36 MHz maximum frequency,  
1.25 DMIPS/MHz (Dhrystone 2.1)  
performance  
– Single-cycle multiplication and hardware  
division  
LQFP144  
20 × 20 mm  
LQFP100  
14 × 14 mm  
LQFP64  
10 × 10 mm  
– 51/80/112 I/Os, all mappable on 16  
external interrupt vectors and almost all  
5 V-tolerant  
Memories  
– 256 to 512 Kbytes of Flash memory  
– up to 48 Kbytes of SRAM  
– Flexible static memory controller with 4  
Chip Select. Supports Compact Flash,  
SRAM, PSRAM, NOR and NAND  
memories  
Debug mode  
– Serial wire debug (SWD) & JTAG interfaces  
– Cortex-M3 Embedded Trace Macrocell™  
Up to 9 timers  
– LCD parallel interface, 8080/6800 modes  
– Up to four 16-bit timers, each with up to 4  
IC/OC/PWM or pulse counters  
Clock, reset and supply management  
– 2 × watchdog timers (Independent and  
Window)  
– 2.0 to 3.6 V application supply and I/Os  
– POR, PDR, and programmable voltage  
detector (PVD)  
– SysTick timer: a 24-bit downcounter  
– 2 × 16-bit basic timers to drive the DAC  
– 4-to-16 MHz crystal oscillator  
– Internal 8 MHz factory-trimmed RC  
– Internal 40 kHz RC with calibration  
capability  
Up to 10 communication interfaces  
2
– Up to 2 x I C interfaces (SMBus/PMBus)  
– Up to 5 USARTs (ISO 7816 interface, LIN,  
IrDA capability, modem control)  
– 32 kHz oscillator for RTC with calibration  
– Up to 3 SPIs (18 Mbit/s)  
Low power  
– Sleep, Stop and Standby modes  
CRC calculation unit, 96-bit unique ID  
– V  
supply for RTC and backup registers  
®
BAT  
ECOPACK packages  
1 x 12-bit, 1 µs A/D converters (up to 16  
channels)  
– Conversion range: 0 to 3.6 V  
Temperature sensor  
Table 1.  
Device summary  
Part number  
Reference  
STM32F101RC STM32F101VC  
STM32F101ZC  
STM32F101xC  
STM32F101xD  
STM32F101xE  
2 × 12-bit D/A converters  
DMA  
STM32F101RD STM32F101VD  
STM32F101ZD  
– 12-channel DMA controller  
– Peripherals supported: timers, ADC, DAC,  
STM32F101RE STM32F101ZE  
STM32F101VE  
2
SPIs, I Cs and USARTs  
Up to 112 fast I/O ports  
September 2009  
Doc ID 14610 Rev 7  
1/106  
www.st.com  
1

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