Multilayer Ceramic Capacitors
AEC-Q200
Approval Sheet
No.
15.
AEC-Q200 Test Condition
Requirements
Test Item
ESD
AEC-Q200-002
Per AEC-Q200-002
* No remarkable damage.
* Cap.: within the specified tolerance.
* Q/D.F. value:
NPO: Cap≥30pF, Q≥1000 ; Cap<30pF, Q≥400+20C.
X7R:
Rated D.F.≦ Exception of D.F. ≦
vol.
≦3%
1206≧0.47µF
≧100V ≦2.5% ≦5%
0603≧0.068µF;0805＞0.1µF;1206≧1µF;1210≧2.2µF
≦10% 0805＞0.22µF;1210≧3.3µF
≦3%
≦5%
0201(50V);0603≧0.047µF; 0805≧0.18µF;1206≧0.47µF
0201≧0.01uF;1210≧3.3µF
50V
35V
≦2.5%
0402≧0.012µF;0603>0.1µF; 0805>0.47µF;
1206≧2.2µF;1210≧10µF
≦10%
≦3.5% ≦10% 0603≧1µF;0805≥2.2µF;1206≧2.2µF;1210≧10µF
≦5%
≦7%
0201≧0.01µF;0805≧1µF;1210≧10µF
0603≧0.33µF
25V
≦3.5%
≦3.5%
0201≧0.1µF;0402≧0.056µF;0603≧0.47µF;
0805≧2.2µF;1206≧4.7µF; 1210≧22µF
≦10%
≦12.5% 0402≧0.33µF
0201≧0.01µF;0402≧0.033µF;0603≧0.15µF;
0805≧0.68µF;1206≧2.2µF;1210≧4.7µF
≦5%
16V
10V
0201≧0.022µF; 0402≧0.15uF;0603>0.47µF;
0805≧2.2µF;1206≧4.7µF;1210≧22µF
≦10%
≦10%
0201≧0.012µF;0402≧0.15µF;0603≧0.33µF;
0805≧2.2µF;1206≧2.2µF;1210≧22µF
≦5%
≦15% 0201≧0.1µF; 0402≧1µF
0201≧0.1µF;0402≧1µF;0603≧10µF;
0805≧4.7µF;1206≧47µF;1210≧100µF
≦20% 0402≧2.2µF
≦15% --- ---
≦15%
6.3V
4V
≦10%
* I.R.: ≥10GΩ or RxC≥500Ω-F whichever is smaller.
Class II (X7R)
Rated voltage
Insulation
Resistance
≧100V: All X7R
50V: 0402>0.01µF;0603≥1µF;0805≥1µF;1206≥4.7µF;1210≥4.7µF
35V: 0805≥2.2µF;1206≥2.2µF;1210≥10µF
25V: 0402≥1µF;0603≥2.2µF;0805≥2.2µF;1206≥10µF;1210≥10µF
16V: 0201≥0.1µF,0402≥0.22µF;0603≥1µF;
0805≥2.2µF;1206≥10µF;1210≥47µF
10GΩ or
RxC≥100 Ω-F
whichever is
smaller.
10V: 0201≥47nF;0402≥0.47µF;0603≥0.47µF;0805≥2.2µF;
1206≥4.7µF;1210≥47µF
6.3V; 4V; Size≥1812
Insulation
Resistance
Rated voltage
100V: 1210≥3.3µF
50V: 0402≥0.1µF;0603≥2.2µF;0805≥10µF;1206≥10µF
35V: 0603≥1µF;
25V: 0201≥0.1µF;0402≥2.2µF;0603≥10µF;0805≥10µF;1206≥22µF
16V: 0603≥10µF;0402≥1µF;0201≥0.22µF
10V: 0201>0.1µF;0402≥1µF;0603≥10µF;0805≥47µF
6.3V: 0201≥0.1µF;0402≥1µF;0603>4.7µF;0805≥47µF;1206≥10µF
4V: 0603≥22µF;0805≥47µF;1206≥100µF
RxC≥50 Ω-F.
16. Solderability
J-STD-002
* Condition A
All terminations shall exhibit a continuous solder coating free from
Un-mounted chips 4hrs / 155°C*dry then
completely immersed for 5 0.5 sec in solder
bath at 235 5°C.
defects from a minimum of 75% of the critical surface area of any individual termination.
JESD22-B102E
* Condition B
Un-mounted chips steam 8 hrs then
completely immersed for 10 1sec in solder
bath at 215+5/-0°C.
* Condition C
Un-mounted chips steam 8 hrs then
completely immersed for 10 1 sec. in solder
bath at 260+0/-5°C.
* "Room condition" Temperature: 15 to 35°C, Relativ e humidity: 25 to 75%, Atmospheric pressure: 86 to 106kPa.
Page 15 of 20
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