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SST39LF800A-55-4C-EKE PDF预览

SST39LF800A-55-4C-EKE

更新时间: 2024-11-19 20:35:11
品牌 Logo 应用领域
美国微芯 - MICROCHIP 可编程只读存储器光电二极管内存集成电路闪存
页数 文件大小 规格书
37页 4158K
描述
512K X 16 FLASH 3V PROM, 55 ns, PDSO48, 12 X 20 MM, ROHS COMPLIANT, MO-142DD, TSOP1-48

SST39LF800A-55-4C-EKE 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:TSOP1
包装说明:TSOP1, TSSOP48,.8,20针数:48
Reach Compliance Code:compliantECCN代码:3A991.B.1.A
HTS代码:8542.32.00.51Factory Lead Time:6 weeks
风险等级:1.64Samacsys Confidence:4
Samacsys Status:ReleasedSamacsys PartID:460283
Samacsys Pin Count:48Samacsys Part Category:Integrated Circuit
Samacsys Package Category:Small Outline PackagesSamacsys Footprint Name:SST39VF6401B-70-4C-EKE
Samacsys Released Date:2019-04-13 11:21:02Is Samacsys:N
最长访问时间:55 ns命令用户界面:YES
通用闪存接口:YES数据轮询:YES
JESD-30 代码:R-PDSO-G48JESD-609代码:e3
长度:18.4 mm内存密度:8388608 bit
内存集成电路类型:FLASH内存宽度:16
湿度敏感等级:3功能数量:1
部门数/规模:256端子数量:48
字数:524288 words字数代码:512000
工作模式:ASYNCHRONOUS最高工作温度:70 °C
最低工作温度:组织:512KX16
封装主体材料:PLASTIC/EPOXY封装代码:TSOP1
封装等效代码:TSSOP48,.8,20封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, THIN PROFILE并行/串行:PARALLEL
峰值回流温度(摄氏度):260电源:3.3 V
编程电压:3 V认证状态:Not Qualified
座面最大高度:1.2 mm部门规模:2K
最大待机电流:0.00002 A子类别:Flash Memories
最大压摆率:0.03 mA最大供电电压 (Vsup):3.6 V
最小供电电压 (Vsup):3 V标称供电电压 (Vsup):3.3 V
表面贴装:YES技术:CMOS
温度等级:COMMERCIAL端子面层:Matte Tin (Sn) - annealed
端子形式:GULL WING端子节距:0.5 mm
端子位置:DUAL处于峰值回流温度下的最长时间:40
切换位:YES类型:NOR TYPE
宽度:12 mmBase Number Matches:1

SST39LF800A-55-4C-EKE 数据手册

 浏览型号SST39LF800A-55-4C-EKE的Datasheet PDF文件第2页浏览型号SST39LF800A-55-4C-EKE的Datasheet PDF文件第3页浏览型号SST39LF800A-55-4C-EKE的Datasheet PDF文件第4页浏览型号SST39LF800A-55-4C-EKE的Datasheet PDF文件第5页浏览型号SST39LF800A-55-4C-EKE的Datasheet PDF文件第6页浏览型号SST39LF800A-55-4C-EKE的Datasheet PDF文件第7页 
2 Mbit / 4 Mbit / 8 Mbit (x16) Multi-Purpose Flash  
SST39LF200A / SST39LF400A / SST39LF800A  
SST39VF200A / SST39VF400A / SST39VF800A  
A Microchip Technology Company  
Data Sheet  
The SST39LF200A/400A/800A and SST39VF200A/400A/800A devices are 128K  
x16 / 256K x16 / 512K x16 CMOS Multi-Purpose Flash (MPF) manufactured with  
SST proprietary, high-performance CMOS SuperFlash technology. The split-gate  
cell design and thick oxide tunneling injector attain better reliability and manufac-  
turability compared with alternate approaches. The SST39LF200A/400A/800A  
write (Program or Erase) with a 3.0-3.6V power supply. The SST39VF200A/400A/  
800A write (Program or Erase) with a 2.7-3.6V power supply. These devices con-  
form to JEDEC standard pinouts for x16 memories.  
Features:  
• Organized as 128K x16 / 256K x16 / 512K x16  
• Fast Erase and Word-Program  
– Sector-Erase Time: 18 ms (typical)  
– Block-Erase Time: 18 ms (typical)  
– Chip-Erase Time: 70 ms (typical)  
– Word-Program Time: 14 µs (typical)  
– Chip Rewrite Time:  
2 seconds (typical) for SST39LF/VF200A  
4 seconds (typical) for SST39LF/VF400A  
8 seconds (typical) for SST39LF/VF800A  
• Single Voltage Read and Write Operations  
– 3.0-3.6V for SST39LF200A/400A/800A  
– 2.7-3.6V for SST39VF200A/400A/800A  
• Superior Reliability  
– Endurance: 100,000 Cycles (typical)  
– Greater than 100 years Data Retention  
• Automatic Write Timing  
• Low Power Consumption  
(typical values at 14 MHz)  
– Internal VPP Generation  
– Active Current: 9 mA (typical)  
• End-of-Write Detection  
– Standby Current: 3 µA (typical)  
– Toggle Bit  
– Data# Polling  
• Sector-Erase Capability  
– Uniform 2 KWord sectors  
• CMOS I/O Compatibility  
• Block-Erase Capability  
• JEDEC Standard  
– Uniform 32 KWord blocks  
– Flash EEPROM Pinouts and command sets  
• Fast Read Access Time  
• Packages Available  
– 55 ns for SST39LF200A/400A/800A  
– 70 ns for SST39VF200A/400A/800A  
– 48-lead TSOP (12mm x 20mm)  
– 48-ball TFBGA (6mm x 8mm)  
– 48-ball WFBGA (4mm x 6mm)  
• Latched Address and Data  
– 48-bump XFLGA (4mm x 6mm) – 4 and 8Mbit  
• All non-Pb (lead-free) devices are RoHS compliant  
www.microchip.com  
©2011 Silicon Storage Technology, Inc.  
DS25001A  
03/11  
 

SST39LF800A-55-4C-EKE 替代型号

型号 品牌 替代类型 描述 数据表
SST39LF800A-55-4C-EK SST

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