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SR406DP-T1-GE3 PDF预览

SR406DP-T1-GE3

更新时间: 2022-09-26 07:35:18
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
13页 512K
描述
N-Channel 25-V (D-S) MOSFET

SR406DP-T1-GE3 数据手册

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New Product  
SiR406DP  
Vishay Siliconix  
N-Channel 25-V (D-S) MOSFET  
FEATURES  
PRODUCT SUMMARY  
Halogen-free According to IEC 61249-2-21  
VDS (V)  
RDS(on) (Ω)  
Qg (Typ.)  
I
D (A)a  
Definition  
40g  
40g  
TrenchFET® Gen III Power MOSFET  
100 % Rg Tested  
100 % Avalanche Tested  
Compliant to RoHS Directive 2002/95/EC  
0.0038 at VGS = 10 V  
0.0048 at VGS = 4.5 V  
25  
15.8 nC  
®
PowerPAK SO-8  
APPLICATIONS  
S
D
POL  
Server  
DC/DC  
6.15 mm  
5.15 mm  
1
S
2
S
3
G
4
D
8
G
D
7
D
6
D
5
Bottom View  
S
N-Channel MOSFET  
Ordering Information: SiR406DP-T1-GE3 (Lead (Pb)-free and Halogen-free)  
ABSOLUTE MAXIMUM RATINGS T = 25 °C, unless otherwise noted  
A
Parameter  
Symbol  
Limit  
25  
Unit  
VDS  
Drain-Source Voltage  
Gate-Source Voltage  
V
VGS  
20  
40g  
40g  
TC = 25 °C  
C = 70 °C  
T
Continuous Drain Current (TJ = 150 °C)  
ID  
27b, c  
TA = 25 °C  
TA = 70 °C  
21.6b, c  
70  
40g  
4.5b, c  
30  
A
IDM  
IS  
Pulsed Drain Current  
TC = 25 °C  
TA = 25 °C  
Continuous Source-Drain Diode Current  
IAS  
Single Pulse Avalanche Current  
Single Pulse Avalanche Energy  
L = 0.1 mH  
EAS  
45  
48  
31  
5.0b, c  
3.2b, c  
mJ  
W
T
C = 25 °C  
TC = 70 °C  
A = 25 °C  
PD  
Maximum Power Dissipation  
T
TA = 70 °C  
TJ, Tstg  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)d, e  
- 55 to 150  
°C  
260  
THERMAL RESISTANCE RATINGS  
Parameter  
Maximum Junction-to-Ambientb, f  
Maximum Junction-to-Case (Drain)  
Symbol  
RthJA  
Typical  
Maximum  
Unit  
t 10 s  
20  
25  
°C/W  
RthJC  
Steady State  
2.1  
2.6  
Notes:  
a. Based on TC = 25 °C.  
b. Surface Mounted on 1" x 1" FR4 board.  
c. t = 10 s.  
d. See Solder Profile (www.vishay.com/ppg?73257). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed copper  
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not  
required to ensure adequate bottom side solder interconnection.  
e. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.  
f. Maximum under Steady State conditions is 65 °C/W.  
g. Package Limited.  
Document Number: 64982  
S09-1095-Rev. A, 15-Jun-09  
www.vishay.com  
1

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