Datasheet > SPG32-601

SPG32-601

更新时间： 2022-05-14 22:15:01

品牌	Logo	应用领域
雷卯电子 - LEIDITECH		/
页数	文件大小	规格书
5页	1016K
描述
Approximately zero leaking current before clamping voltage

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SPG32-601 数据手册

SPG32-501 Series

Recommended Soldering Conditions

Flow Soldering Conditions

Soldering

Cooling

Air Priheat

260℃

250

200

150

150~180℃

100

60~120 sec

3~4 sec

1) Time shown in the above ﬁgures is measured from the point when chip surface reaches temperature.

2) Temperature difference in high temperature part should be within 110

3) After soldering, do not force cool, allow the parts to cool gradually.

℃

Hand Soldering

Solder iron temperature: 350±5

Heating time: 3 seconds max.

℃

General attention to soldering

● High soldering temperatures and long soldering times can cause leaching of the termination, decrease in adherence strength, and the change

of characteristic may occur.

● For soldering, please refer to the soldering curves above. However, please keep exposures to temperatures exceeding 200 to fewer than

℃

50 seconds.

● Please use a mild ﬂux (containing less than 0.2wt% CI). Also, if the ﬂux is water soluble, be sure to wash thoroughly to remove any residue

from the underside of components that could affect resistance.

Cleaning

When using ultrasonic cleaning, the board may resonate if the output power is too high. Since this vibration can cause cracking or a decrease in

the adherence of the termination, we recommend that you use the conditions below.

Frequency: 40kHz max.

Output power: 20W/liter

Cleaning time: 5 minutes max.

4/5

Rev :01.06.2017

www.leiditech.com

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