SPG32-501 Series
Recommended Soldering Conditions
Flow Soldering Conditions
Soldering
Cooling
Air Priheat
260℃
250
200
150
150~180℃
100
50
0
60~120 sec
3~4 sec
1) Time shown in the above figures is measured from the point when chip surface reaches temperature.
2) Temperature difference in high temperature part should be within 110
3) After soldering, do not force cool, allow the parts to cool gradually.
℃
Hand Soldering
Solder iron temperature: 350±5
Heating time: 3 seconds max.
℃
General attention to soldering
● High soldering temperatures and long soldering times can cause leaching of the termination, decrease in adherence strength, and the change
of characteristic may occur.
● For soldering, please refer to the soldering curves above. However, please keep exposures to temperatures exceeding 200 to fewer than
℃
50 seconds.
● Please use a mild flux (containing less than 0.2wt% CI). Also, if the flux is water soluble, be sure to wash thoroughly to remove any residue
from the underside of components that could affect resistance.
Cleaning
When using ultrasonic cleaning, the board may resonate if the output power is too high. Since this vibration can cause cracking or a decrease in
the adherence of the termination, we recommend that you use the conditions below.
Frequency: 40kHz max.
Output power: 20W/liter
Cleaning time: 5 minutes max.
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Rev :01.06.2017
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