SMD POWER INDUCTORS
SPC3010FT SERIES
6. RELIABILITY & TEST CONDITION :
ITEM
PERFORMANCE
TEST CONDITION
Mechanical
Substrate bending
ǻL/Lo<±10%
The sample shall be soldered onto the printed circuit board
in figure 1 and a load applied until the figure in the arrow
direction is made approximately 3mm.(keep time 30 secs)
There shall be no mechanical damage or
electrical damage.
Ø4.5
100
50
t = 1.6
20
30
30
20
Bending test board
20
10
R5
45±2
45±2
R340
PRESSURE ROD figure-1
Vibration
ǻL/Lo<±10%
The sample shall be soldered onto the printed circuit board
and when a vibration having an amplitude of 1.52mm and
a frequency of from 10 to 55Hz/1 minute repeated should
There shall be no mechanical damage.
be applied to the 3 directions (X,Y,Z) for 2 hours each.
(A total of 6 hours)
Solderability
New solder
More than 90%
Flux (rosin, isopropyl alcohol{JIS-K-1522}) shall be coated
over the whole of the sample before hard, the sample shall
then be preheated for about 2 minutes in a temperature of
130~150°C and after it has been immersed to a depth 0.5mm
below for 3±0.2 seconds fully in molten solder M705 with
a temperature of 245±5°C.
More than 90% of the electrode sections shall be cowered
with new solder smoothly when the sample is taken out of
the solder bath.
Resistance to Soldering heat
(reflow soldering)
There shall be no damage or problems.
Soldering
(Peak temperature 260±3°C 10sec)
300
250
30 sec Min.
(230°C Max.)
200
150
100
50
Pre-heating
Slow cooling
(Stored at room
temperature)
150~
180°C
2 min. or more
10
2 min.
sec
The specimen shall be passed through the reflow oven with
the condition shown in the above profile for 1 time.
The specimen shall be stored at standard atmospheric
conditions for 1 hour, after which the measurement shall
be made.
NOTE : Specifications subject to change without notice. Please check our website for latest information.
07.01.2010
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 3