SNAP PAC Racks
Specifications
Power1 Requirements
5.0 to 5.2 VDC @ 4.2 Amps max
SNAP-PAC-R1
SNAP-PAC-R2
SNAP-PAC-EB1
SNAP-PAC-EB2
SNAP-PAC-SB1
SNAP-PAC-SB2
SNAP-PAC-R1-W
SNAP-PAC-R2-W
SNAP-PAC-EB1-W
SNAP-PAC-EB2-W
SNAP-PAC-R1-FM
SNAP-PAC-R2-FM
SNAP-PAC-EB1-FM
SNAP-PAC-EB2-FM
I/O Processor2
Compatibility
Replacement Fuse
SNAP-FUSE7.5AB or Littelfuse 297 07.5
22 to 14 AWG
Rack Power Terminals
Wire Size
Module Mating Connector Pinout (female)
Operating Temperature –20 to 70 °C
Storage Temperature
Relative Humidity
–40 to 85 °C
95%, non-condensing
Non -FM models: UL, CE, RoHS, DFARS
-FM models: FM, CE, RoHS, DFARS
Agency Approvals
Warranty
30 months from date of manufacture
1 Power requirements shown are for a rack, a processor, and a full load of
analog modules. Power requirements for SNAP serial and high-density
modules are higher. See module data sheets.
2 “I/O Processor” means a SNAP PAC brain or SNAP PAC on-the-rack
controller. For compatibility with legacy Opto 22 products, see form #1693,
Legacy and Current Product Comparison and Compatibility Charts.
Power Schematic
Notes on Grounding
WARNING: EXPLOSION HAZARD. DO NOT DISCONNECT
WHILE CIRCUIT IS LIVE UNLESS AREA IS KNOWN TO BE NON-
HAZARDOUS.
Pin 18 E GND on each module (see diagram above right) is connected
to the rack’s GND. Module hold-down screws are also connected to
the rack’s GND.
AVERTISSEMENT: RISQUE D'EXPLOSION. NE PAS
DÉBRANCHER TANT QUE LE CIRCUIT EST SOUS TENSION, À
MOINS QU'IL NE S'AGISSE D'UN EMPLACEMENT NON
DANGEREUX.
The brain or rack-mounted controller is connected to the rack’s GND
through its center hold-down screw.
Opto 22 • 43044 Business Park Drive • Temecula, CA 92590-3614 • www.opto22.com
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© 2007–2014 Opto 22. All rights reserved. Dimensions and specifications are subject to change. Brand or product names used herein are trademarks or registered trademarks of their respective companies or organizations.