Datasheet > SN74LVC2G07_07

SN74LVC2G07_07

更新时间： 2024-01-27 02:38:15

品牌	Logo	应用领域
德州仪器 - TI		驱动器输出元件
页数	文件大小	规格书
13页	497K
描述
DUAL BUFFER/DRIVER WITH OPEN-DRAIN OUTPUTS

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SN74LVC2G07_07 数据手册

SN74LVC2G07

DUAL BUFFER/DRIVER

WITH OPEN-DRAIN OUTPUTS

www.ti.com

SCES308G–AUGUST 2001–REVISED JANUARY 2007

FEATURES

•

Available in the Texas Instruments

NanoFree™ Package

•

Typical V_OHV(Output V_OHUndershoot)

>2 V at V_CC= 3.3 V, T_A= 25°C

•

Supports 5-V V_CCOperation

I_offSupports Partial-Power-Down Mode

Operation

Inputs and Open-Drain Outputs Accept

Voltages up to 5.5 V

Latch-Up Performance Exceeds 100 mA Per

JESD 78, Class II

•

Max t_pdof 3.7 ns at 3.3 V

ESD Protection Exceeds JESD 22

Low Power Consumption, 10-µA Max I_CC

±24-mA Output Drive at 3.3 V

–

2000-V Human-Body Model (A114-A)

200-V Machine Model (A115-A)

Typical V_OLP(Output Ground Bounce)

<0.8 V at V_CC= 3.3 V, T_A= 25°C

1000-V Charged-Device Model (C101)

YZP PACKAGE

(BOTTOM VIEW)

DBV PACKAGE

(TOP VIEW)

DCK PACKAGE

(TOP VIEW)

GND

V_CC

See mechanical drawings for dimensions.

DESCRIPTION/ORDERING INFORMATION

This dual buffer/driver is designed for 1.65-V to 5.5-V V_CCoperation. The output of the SN74LVC2G07 is open

drain and can be connected to other open-drain outputs to implement active-low wired-OR or active-high

wired-AND functions. The maximum sink current is 32 mA.

NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the

package.

This device is fully specified for partial-power-down applications using I_off. The I_offcircuitry disables the outputs,

preventing damaging current backflow through the device when it is powered down.

ORDERING INFORMATION

T_A

PACKAGE⁽¹⁾

ORDERABLE PART NUMBER TOP-SIDE MARKING⁽²⁾

NanoFree™ – WCSP (DSBGA)

0.23-mm Large Bump – YZP (Pb-free)

SOT (SOT-23) – DBV

Reel of 3000

SN74LVC2G07YZPR

_ _ _CV_

C07_

Reel of 3000

Reel of 250

SN74LVC2G07DBVR

SN74LVC2G07DCKR

SN74LVC2G07DCKT

–40°C to 85°C

SOT (SC-70) – DCK

CV_

(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at

www.ti.com/sc/package.

(2) DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.

YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following

character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

NanoFree is a trademark of Texas Instruments.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

12 3 4 5 6 7...13

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SN74LVC2G07DBVRE4	TI	获取价格	DUAL BUFFER/DRIVER WITH OPEN DRAIN OUTPUTS
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SN74LVC2G07DCKR	TI	获取价格	DUAL BUFFER/DRIVER WITH OPEN DRAIN OUTPUTS
SN74LVC2G07DCKR	UMW	获取价格	逻辑集成电路
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