TVS Diodes
Surface Mount – 1500W > SMCJ-HRA Series
Soldering Parameters
Reflow Condition
Lead–free assembly
-Temperature Min (Ts(min)
-Temperature Max (Ts(max)
-Time (min to max) (ts)
)
150°C
tp
TP
Pre Heat
)
200°C
Ramp-up
Critical Zone
to T
T
L
P
60 – 180 secs
TL
tL
Average ramp up rate (LiquidusTemp (TL) to peak 3°C/second max
Ts(max)
T
S(max) toTL - Ramp-up Rate
3°C/second max
217°C
Ramp-down
Ts(min)
-Temperature (TL) (Liquidus)
-Time (min to max) (ts)
Reflow
ts
Preheat
60 – 150 seconds
260+0/-5 °C
PeakTemperature (TP)
25˚C
Time within 5°C of actual peakTemperature (tp)
Ramp-down Rate
20 – 40 seconds
6°C/second max
8 minutes Max.
280°C
t 25˚C to Peak
Time (t)
Time 25°C to peakTemperature (TP)
Do not exceed
Physical Specifications
Environmental Specifications
Weight
Case
0.007 ounce, 0.21 grams
JEDEC DO214AB. Molded plastic body over glass passivated
junction
HighTemp. Storage
HTRB
JESD22-A103
JESD22-A108
JESD22-A106
Thermal Shock
MSL
Polarity
Color band denotes positive end (cathode) except Bidirectional
MatteTin-plated leads, Solderable per JESD22-B102
JEDEC-J-STD-020, Level 1
JESD22-A101
Terminal
H3TRB
RSH
JESD22-B106
Dimensions
Inches
Millimeters
DO-214AB (SMC J-Bend)
Cathode Band
Dimensions
Min
0.114
0.260
0.220
0.079
0.030
0.002
0.305
0.006
0.129
0.094
-
Max
Min
2.900
6.600
5.590
2.060
0.760
0.051
7.750
0.152
3.300
2.400
-
Max
(for Uni-directional products only)
A
B
C
D
E
F
0.126
0.280
0.245
0.103
0.060
0.008
0.320
0.012
-
3.200
7. 110
6.220
2.620
1.520
0.203
8.130
0.305
-
C
A
D
B
G
H
I
H
J
-
-
F
K
L
0.165
-
4.200
-
E
G
0.094
2.400
J
K
L
I
© 2020 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 02/14/20