SM8S10A-AL thru SM8S43A-AL
JIEJIE MICROELECTRONICS CO. , Ltd
SOLDERING PARAMETERS
Pb-Free assembly
(see figure at right)
Reflow Condition
-Temperature Min (Ts(min)
-Temperature Max(Ts(max)
-Time (Min to Max) (ts)
)
+150℃
Pre
)
+200℃
Heat
Reflow condition
60-180 secs.
tp
TP
Average ramp up rate (Liquidus Temp
(TL)to peak)
Critical Zone
TL to TP
Ramp-up
3℃/sec. Max
TL
tL
TS(max)
Ts(max) to TL - Ramp-up Rate
3℃/sec. Max
+217℃
Ramp-down
-Temperature(TL)(Liquidus)
Reflow
Preheat
ts
TS(min)
25
-Temperature(tL)
60-150 secs.
+260(+0/-5)℃
time to peak temperatue
Time
Peak Temp (Tp)
(t 25℃ to peak)
Time within 5℃of actual Peak Temp (tp) 20-40secs.
Ramp-down Rate
6℃/sec. Max
8 min. Max
+260℃
Time 25℃to Peak Temp (TP)
Do not exceed
PACKAGE MECHANICAL DATA
A
B
Dimensions
Ref.
Millimeters
Inches
Min.
Max.
10.5
8.7
Min.
0.374
0.327
0.524
0.592
0.335
0.374
0.094
0.020
0.106
0.075
0.185
0.559
0.138
0.063
Max.
0.413
0.342
0.539
0.628
0.358
0.398
0.118
0.028
0.146
0.083
0.201
0.583
0.161
0.087
A1
G
9.5
8.3
A
B
C
D
E
F
13.3
15.0
8.5
9.5
2.4
0.5
2.7
13.7
16.0
9.1
H
A
J
10.1
3.0
G
H
J
0.7
3.7
1.9
4.7
2.1
K
L
5.1
14.2
3.5
1.6
14.8
4.1
M
N
P
G
2.2
DO-218AB
TEL:+86-513-83639777
-5 / 6-
http://www.jjwdz.com