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SM76299

更新时间: 2024-11-19 03:31:39
品牌 Logo 应用领域
伯恩斯 - BOURNS 变压器
页数 文件大小 规格书
1页 178K
描述
SHDSL Line Transformer

SM76299 数据手册

  
Features  
Applications  
Operating temperature -40 °C to +85 °C  
To be used with the Globespan SHDSL  
chipset  
Designed to meet UL1950 and EN60950  
supplementary insulation requirements  
for operating voltages up to 250 Vrms  
SM76299  
Lead free version available (see How to  
Order)  
Lead free versions are RoHS compliant*  
SM76299 - SHDSL Line Transformer  
Electrical Schematic  
Electrical Specifications @ 25 °C  
Product Dimensions  
Turns Ratio  
1
.711 ± .050  
9 PLCS.  
(1-5 Tie 4+2):(9-7)..............4CS:1 1 ꢀ  
Polarity ......................1, 2, 9 same phase  
HIPOT (1-4, 2-5 to 9-7) ............1875 VAC  
DCR  
(1-4)................................1.45 1ꢁ ꢀ  
(2-5)................................1.45 1ꢁ ꢀ  
(9-7)................................ꢁ.45 1ꢁ ꢀ  
OCL (1-5 Tie 4+2)  
(.028 ± .002)  
9
7
4
2
5
4
6
7
2.5  
(.098)  
5
13.46  
(.530)  
SM76299  
MAX.  
5
2
1
8
10.00  
(.394)  
MAX.  
(DATECODE)  
9
1ꢁ  
How to Order  
........2.ꢁ7 mH 4 ꢀ ꢂ 1ꢁ ꢃHꢄ 1ꢁꢁ mV  
........2.ꢁ7 mH 4 ꢀ ꢂ 1ꢁ ꢃHꢄ 1ꢁꢁ mV,  
1ꢁꢁ mADC  
17.65  
MAX.  
(.695)  
SM76299E __  
Model  
L
L (1-5 Tie 4+2) short (9-7)  
13.50  
MAX.  
(.531)  
............15 µH max. ꢂ 1ꢁꢁ ꢃHꢄ 1ꢁꢁ mV  
Cs (1-9 Tie 4+2)  
Termination  
Blanꢃ = Tin-lead  
L = Tin only (lead free)  
............65 pF max. ꢂ 1ꢁꢁ ꢃHꢄ 1ꢁꢁ mV  
12.32  
(.485)  
Packaging Specifications  
MAX.  
Tape & Reel* ........................2ꢁꢁ pcs./reel  
*”E” suffix at end of part number  
designates tape & reel pacꢃaging, e.g.  
SM76299E.  
1.01  
(.040)  
TYP.  
12.06  
(.475)  
MAX.  
0.12  
(.005)  
10 SURFACES  
2.54  
(.100)  
2.48  
(.098)  
10.00  
(.394)  
15.36  
(.605)  
1.29 ± .050  
(.051 ± .002)  
10 PLCS.  
Recommended PAD layout  
MM  
(INCHES)  
DIMENSIONS ARE:  
TOLERANCE:  
0.25  
(.010)  
03/05  
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex  
Specifications are subject to change without notice.  
Customers should verify actual device performance in their specific applications.  

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