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SM74104SD/NOPB PDF预览

SM74104SD/NOPB

更新时间: 2024-02-24 06:18:11
品牌 Logo 应用领域
德州仪器 - TI 驱动器高压
页数 文件大小 规格书
16页 359K
描述
1.8-A, 100-V half bridge gate driver with 8-V UVLO and adaptive delay 10-WSON -40 to 125

SM74104SD/NOPB 技术参数

生命周期:Obsolete包装说明:,
Reach Compliance Code:unknown风险等级:5.84
Base Number Matches:1

SM74104SD/NOPB 数据手册

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Ordering Information  
NSC Package  
Drawing  
Ordering Number  
Package Type  
Package Marking  
Supplied As  
SM74104SD  
SM74104SDE  
SM74104SDX  
SM74104MA  
SM74104MAE  
SM74104 MAX  
1000 Units in Tape and Reel  
250 Units in Tape & Reel  
4500 Units in Tape & Reel  
95 Units in Rail  
LLP-10  
SOIC-8  
S74104  
SDC10A  
M08A  
S74104  
250 Units in Tape & Reel  
2500 Units in Tape & Reel  
Pin Descriptions  
Pin  
Name  
Description  
Application Information  
SOIC-8 LLP-10  
1
1
VDD  
HB  
Positive gate drive supply Locally decouple to VSS using low ESR/ESL capacitor, located as close to  
IC as possible.  
2
2
High side gate driver  
bootstrap rail  
Connect the positive terminal of bootstrap capacitor to the HB pin and  
connect negative terminal to HS. The Bootstrap capacitor should be placed  
as close to IC as possible.  
3
4
3
4
HO  
HS  
High side gate driver output Connect to gate of high side MOSFET with short low inductance path.  
High side MOSFET source Connect to bootstrap capacitor negative terminal and source of high side  
connection  
MOSFET.  
5
6
7
8
RT  
IN  
Deadtime programming pin Resistor from RT to ground programs the deadtime between high and low  
side transitions.The resistor should be located close to the IC to minimize  
noise coupling from adjacent traces.  
Control input  
Logic 1 equals High Side ON and Low Side OFF. Logic 0 equals High Side  
OFF and Low Side ON.  
7
8
9
VSS  
LO  
Ground return  
All signals are referenced to this ground.  
10  
Low side gate driver output Connect to the gate of the low side MOSFET with a short low inductance  
path.  
Note: For LLP-10 package, it is recommended that the exposed pad on the bottom of the SM74104 be soldered to ground plane on the PC board, and  
the ground plane should extend out from beneath the IC to help dissipate the heat. Pins 5 and 6 have no connection.  
3
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