Ordering Information
NSC Package
Drawing
Ordering Number
Package Type
Package Marking
Supplied As
SM74104SD
SM74104SDE
SM74104SDX
SM74104MA
SM74104MAE
SM74104 MAX
1000 Units in Tape and Reel
250 Units in Tape & Reel
4500 Units in Tape & Reel
95 Units in Rail
LLP-10
SOIC-8
S74104
SDC10A
M08A
S74104
250 Units in Tape & Reel
2500 Units in Tape & Reel
Pin Descriptions
Pin
Name
Description
Application Information
SOIC-8 LLP-10
1
1
VDD
HB
Positive gate drive supply Locally decouple to VSS using low ESR/ESL capacitor, located as close to
IC as possible.
2
2
High side gate driver
bootstrap rail
Connect the positive terminal of bootstrap capacitor to the HB pin and
connect negative terminal to HS. The Bootstrap capacitor should be placed
as close to IC as possible.
3
4
3
4
HO
HS
High side gate driver output Connect to gate of high side MOSFET with short low inductance path.
High side MOSFET source Connect to bootstrap capacitor negative terminal and source of high side
connection
MOSFET.
5
6
7
8
RT
IN
Deadtime programming pin Resistor from RT to ground programs the deadtime between high and low
side transitions.The resistor should be located close to the IC to minimize
noise coupling from adjacent traces.
Control input
Logic 1 equals High Side ON and Low Side OFF. Logic 0 equals High Side
OFF and Low Side ON.
7
8
9
VSS
LO
Ground return
All signals are referenced to this ground.
10
Low side gate driver output Connect to the gate of the low side MOSFET with a short low inductance
path.
Note: For LLP-10 package, it is recommended that the exposed pad on the bottom of the SM74104 be soldered to ground plane on the PC board, and
the ground plane should extend out from beneath the IC to help dissipate the heat. Pins 5 and 6 have no connection.
3
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